Method of joining pipes and fittings

ABSTRACT

A method for joining a first conduit section with a second conduit section. The method includes: a) inserting a first end of the second conduit section in an open first end of the first conduit section with a gasket extending between an inner surface of the first conduit section and an outer surface of the second conduit section; b) positioning a flexible substrate having a bonding agent provided on at least a portion of an inner side of the flexible substrate to extend from an outer surface of the first conduit to an outer surface of the second conduit; c) applying pressure to the flexible substrate whereby the bonding agent is pressed against an outer surface of the first and second conduit sections; and d) heating the bonding agent whereby the bonding agent is secured to the outer surface of the first and second conduit sections.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims foreign priority benefits under 35 U.S.C. §119(a)-(d) to Canadian Patent Application no. 2,863,272, filed on Sep. 12,2014, which is hereby incorporated by reference in its entirety.

FIELD

This disclosure relates generally to the connection of pipes andfittings that are used to convey a fluid, and more particularly to amechanical restraint member to secure components of a piping system toeach other and methods for joining pipes and fittings that involves theapplication of the mechanical restraint member.

INTRODUCTION

Piping systems are used to convey liquids and/or gasses to, between, orwithin, residential, commercial, and/or industrial buildings. Forexample, most municipalities have a piping system for providing potableand/or non-potable water from one or more reservoirs, pumping stations,and/or water towers to one or more buildings (e.g. residential,commercial, or industrial) and/or other locations (e.g. fire hydrants).Other examples of municipal piping systems include sanitary sewers,storm sewers, and the like.

Typically, piping systems are made up of a number of componentsincluding straight or curved pipe sections, fittings (e.g. elbowfittings, T-junctions, straight connectors and the like), valves, etc.to provide an interior flow path for the liquid being conveyed. The pipesections and fittings may be fabricated from concrete, ductile iron,plastics such as polyvinyl chloride (PVC), polyethylene orpolypropylene, and/or a combination of these materials. Typically, apiping system (such as a system comprising thermoplastic pipes), isassembled such that the components are joined in a manner that providesa durable connection that prevents or inhibits the components fromseparating or cracking due to mechanical, thermal, and/or hydraulicstresses applied to the piping system. Separation of any of thecomponents of the piping system or cracking of any element of the pipingsystem may permit fluid to leak out of the piping system and, e.g.,thereby damage the surrounding structure and/or pollute the groundwater.

Municipal piping systems (e.g. potable water distribution systems) oftenoperate with relatively high internal hydraulic pressures and flowrates. When coupling components of a piping system together (e.g. twolengths of pipe, a length of pipe to a fitting or a valve) the jointmust resist both forces imposed by the internal hydraulic pressure ofthe water (e.g. internal fluid pressure which tends to separate thecoupled components) and those forces imposed by a flowing mass of liquidwithin the piping system when it changes direction. These combinedforces tend to both separate the joint and to also force the liquid outof the joint. In addition, the joint must resist external forces thatmay be applied, such as by movement of the ground in which the pipingsystem is located, e.g., due to settling of the soil and the like.

Joint architectures in general use include insertion fits, wherein oneend of one part of a piping system is inserted into an open end ofanother part of the piping system. For example, in bell and spigot typecouplings, an end of a pipe is inserted into a socket or bell of anotherpipe that receives the pipe end therein. To capture and hold or restrainthe pipe end within the recess, a separate fitting may be used to securethe components of the piping system together. Types of fittings ingeneral use today include push-on joint fittings and mechanical jointfittings.

A push-on joint fitting is exemplified by U.S. Pat. No. 3,963,298. Asdisclosed therein, a push-on joint fitting receives a pipe end andfrictionally holds the pipe end within a bell of the push-on fitting. Inuse, a gasket is placed inside the bell in a gasket seat and the pipe isthen inserted into the bell past the gasket. A considerable force istypically required to insert the pipe end past the gasket. Accordingly,a jacking mechanism may be attached to the pipe end and the bell inorder to force the tapered end of the pipe past the gasket until thepipe bottoms out in the socket. The assembly of push-on fittings can becomplicated and time consuming.

Typically, mechanical joint fittings utilize a flange provided on bothcomponents that are to be connected together, e.g., the end of a pipeand a bell of the fitting in which the pipe end is to be inserted. Theflanges have axial bolt holes. In use, the pipe end may be inserted intothe bell with minimal force until the pipe end bottoms out in thesocket. The gasket may then be inserted into the gasket seat of thebell, where it is caulked or pounded into place as necessary. A glandmay be brought into position touching the gasket. T-bolts may then beinserted into holes provided in the flanges and then tightened. Thebolts are typically tightened in a star pattern. The use of externalfittings requires care to ensure that the bolts are tightened to therequired degree. A further issue is that many fittings are installed ina trench, making access to the bolts on the bottom of the joint aproblem.

Once an installation is complete (e.g. a piping system is buried under aroad), accessing the piping system to repair a leak is typically timeconsuming and expensive.

SUMMARY

The following introduction is provided to introduce the reader to themore detailed discussion to follow. The introduction is not intended tolimit or define any claimed or as yet unclaimed invention. One or moreinventions may reside in any combination or sub-combination of theelements or process steps disclosed in any part of this documentincluding its claims and figures.

This disclosure sets out methods for joining components of a pipingsystem (e.g. pipes, fittings, and the like) utilizing a mechanicalrestraint member located directly on the exterior surface of thecomponents that resists axial outward movement of the components. Thedisclosure also sets out a mechanical restraint member that may beutilized as well and a pipe securing apparatus that may be used and anapparatus for examining a joint so made.

In one broad aspect, the mechanical restraint member is positioned onthe outer surface of the components so as to extend from one componentto the other component to thereby inhibit or prevent axial outwardmovement of the components. Accordingly, once two piping system conduitshave been joined together, such as by using an insertion fit, arestraint member extending in the axial direction is applied to theouter surface of the conduits to inhibit or prevent the conduits frommoving away from each other wherein the restraint member is locatedessentially at the outer wall of the conduits.

In accordance with this aspect, the restraint member may be bonded orchemically adhered to the outer surface of the conduits. An advantage ofthis design is that a mechanical member is not physically secured to anouter wall of a conduit, such as by wedges that are inserted into anexternal groove of a pipe, or the like. An axially extending member thatis bonded or chemically adhered to the outer surface enables the loadingto be applied over a larger surface area and thereby reduces pointstresses that may otherwise occur. Therefore, the area of contactbetween the restraint member and the components is greater than intypical designs in common use today. This allows the restraining forceto be distributed over a relatively large area, and thereby decreasesthe high load-per-unit-area on the components of the piping system thatmay be produced by typical designs in common use today. In particular,the area of contact between typical mechanical joint fittings and thecomponents being restrained is relatively small (e.g. point contactloads where discrete mechanical fasteners such as wedges and the likepress into the outer surface of the pipe). The axial restraint forceprovided by such typical mechanical joint fittings is transmittedthrough a relatively small area of the component's surface which mayresult in localized loading at these points of contact that can be quitehigh, imposing a relatively high load-per-unit-area. This requires thatthe portion of the wall of the conduit on which these point loads areapplied have sufficient structural integrity to absorb the axialstresses so that a fluid tight seal is maintained at the joint. Inaddition, the point loads may also impose a relatively high inwardradial stress on the wall of the component, in addition to the axialstresses resulting from the restraining forces being transferred to thecomponents by the mechanical joint fittings.

Another advantage of this design is that the restraint member isradially located at (or directly adjacent) the position at which theoutward axial forces (e.g., the hydrostatic pressure internal of thepiping system once in use) are applied. In contrast, typical mechanicaljoint fittings use flanges or collars through which bolts to secure thecomponents together. These bolts are located radially outwardly of thepipe as they are inserted into flanges that are applied to thecomponents. Therefore, the axial restraint force provided by the boltsis transmitted radially inwardly by the flanges to the components. Oneproblem with this design is that localized angular point loading isapplied at the juncture of the flange and the axial wall of thecomponent. In particular, a moment arm is created by the flange, and thewall of the component must be design to withstand the increased stressproduced by the moment arm.

Another advantage of this design is that the restraint member does notmechanically penetrate the wall of the components being restrained. Incontrast, typical mechanical joint fittings use mechanical attachmentmeans that are inserted into grooves provided in the outer wall of thepiping system component, or may otherwise penetrate at least a portionof the outer wall. One problem that this may create is that theeffective thickness of the wall of the piping system component isdecreased, which leads to the component having a lower strength.

In accordance with this aspect, the restraint member may be bonded orchemically adhered to the outer surface of the conduits. An advantage ofthis design is that a mechanical member is not physically secured to anouter wall of a conduit, such as by wedges that are inserted into anexternal groove of a pipe, of the like. An axially extending member thatis bonded or chemically adhered to the outer surface enables the loadingto be applied over a larger surface area and thereby reduces pointstresses that may otherwise occur.

Various types of mechanical restraint members may be used. Generally, amechanical restraint member comprises a flexible substrate bonded by abonding agent to the outer surface of each of the piping systemcomponents that are used to form a joint. The bonding agent may beselected based on the composition of the substrate and the componentsthat are to be joined together. It will be appreciated that the type offlexible substrate and/or the type and amount of bonding agent used tosecure a joint may vary, depending on the requirements of the joint tobe restrained. For example, a mechanical restraint member may beprovided around most or substantially all of the outer perimeter of thejoint being restrained. Alternatively, the mechanical restraint membermay only be applied to a portion of the perimeter of the joint. Forexample, multiple mechanical restraint members that are spaced apart maybe applied around a joint.

In one embodiment, a mechanical restraint member suitable for use with aplastic piping system such as a thermoplastic piping system may comprisea woven or non-woven synthetic-fiber substrate, such as fiberglass orcarbon fiber, bonded to the piping system components using a thermallyactivated bonding agent, such as a thermoplastic or thermoset resin.

The bonding agent may be any composition that may chemically secure theflexible substrate to a component of the piping system. The bondingagent may be in the nature of an adhesive (which may be a thermallyactivated or solvent based adhesive) or the same material or a materialthat is compatible with, the material from which the components aremade. For example, if the components that are to be joined together aremade of polyvinylchloride (PVC), then the bonding agent may be PVC or acompatible plastic. Accordingly once the outer wall of the component andthe bonding agent are heated, the PVC may blend together to form aunitary assembly (the substrate, the bonding agent and the component)once the PVC cools and solidifies. It will be appreciated that themethod used to activate the bonding agent will vary depending upon thenature of the bonding agent.

It will be appreciated that if the components that are to be joinedtogether are made of different materials, then the flexible substratemay contain two or more different bonding agents. For example,considered in the axial direction, one half may have a bonding agentsuitable for the first component to which it will be applied and theother half may have a different bonding agent suitable for the secondcomponent to which it will be applied.

The mechanical restraint members described herein may be applied to aconnected, but unrestrained joint in a piping system by wrapping orotherwise positioning a sheet or sheets of the flexible substratecomprising the bonding agent about the joint to be restrained, and thenapplying both heat (to activate the bonding agent) and pressure (topromote a good bond) to the sheet or sheets until the bonding agent hassufficiently cured.

In one method of application, a pressure cuff which may have anintegrated heating element may be wrapped around the joint once thesheet(s) of flexible substrate are in position, and the pressure cuffmay automatically apply the proper amount of temperature and pressure toprovide a good quality bond.

An advantage over traditional methods of restraining piping systemcomponents is that by chemically—as opposed to mechanically—bonding themechanical restraint member to the piping system components, the risk ofdeformation, cracking, or other structural damage to the piping systemcomponents during installation are significantly reduced (if noteliminated).

Another advantage is that since the area of bonded contact of mechanicalrestraint member with the piping system components will generally bemuch greater than in traditional methods, known structural issuesrelating to e.g. point loading may be alleviated or eliminated.

The mechanical restraint member may be used with piping systemcomponents may be made of concrete, metal, or plastic materials known inthe piping arts. The plastic material may be a thermoplastic materialand may be one or more of acrylonitrile butadiene styrene (ABS), PVC,chlorinated PVC (CPVC), ethylene vinyl acetate (EVA), polyethylene (PE),and the like. Preferred materials comprise PVC and/or CPVC.

In accordance with one broad aspect, there is provided a method forjoining a first conduit section having an open first end and an innersurface with a second conduit section having an outer surface, themethod comprising: a) inserting a first end of the second conduitsection in the open first end of the first conduit section with a gasketextending between the inner surface of the first conduit section and theouter surface of the second conduit section; b) positioning a flexiblesubstrate having an activatable bonding agent provided on at least aportion of an inner side of the flexible substrate to extend from anouter surface of the first conduit to an outer surface of the secondconduit; c) applying pressure to the flexible substrate whereby thebonding agent is pressed against an outer surface of the first andsecond conduit sections; and, d) activating the bonding agent wherebythe bonding agent is secured to the outer surface of the first andsecond conduit sections.

In accordance with another broad aspect, there is provided a method forjoining a first conduit section having an open first end and an innersurface with a second conduit section having an outer surface, themethod comprising: a) inserting a first end of the second conduitsection in the open first end of the first conduit section with a gasketextending between the inner surface of the first conduit section and theouter surface of the second conduit section; b) positioning a flexiblesubstrate on each of the first and second conduits with an activatablebonding agent positioned between an inner side of the flexible substrateand an outer surface of each of the first conduit and the secondconduit; c) applying pressure to the flexible substrate whereby thebonding agent is pressed against an outer surface of the first andsecond conduit sections while the bonding agent bonds to the outersurface of the first and second conduit sections.

In some embodiments, at least some of the activatable bonding agent ispositioned between an inner side of the flexible substrate and an outersurface of each of the first conduit and the second conduit prior to thepressure being applied.

In some embodiments, at least some of the activatable bonding agent ispositioned between an inner side of the flexible substrate and an outersurface of each of the first conduit and the second conduit after thepressure is applied.

In some embodiments, the step of positioning the flexible substratecomprises wrapping the flexible substrate around the exterior surface ofthe first and second conduits.

In some embodiments, the flexible substrate is secured in position by anadhesive after the flexible substrate has been wrapped around theexterior surface of the first and second conduits.

In some embodiments, the adhesive is a releasable adhesive whereby theflexible adhesive is repositionable.

In some embodiments, the step of applying pressure comprises positioningan inflatable member around an exterior surface of the flexiblesubstrate and inflating the inflatable member.

In some embodiments, the inflatable member comprises an inflatableannular member and the method further comprises sliding the inflatablemember along one of the conduit sections and positioning the inflatablemember to overlie at least a portion of the flexible substrate.

In some embodiments, the inflatable member comprises a longitudinallyextending member having a first portion that is securable to a secondportion and the method further comprises wrapping the longitudinallyextending member around at least one of the conduit sections andsecuring the first portion to the second portion such that theinflatable member overlies at least a portion of the flexible substrate.

In some embodiments, the flexible substrate includes an inflatablemember and the step of applying pressure comprises inflating theinflatable member.

In some embodiments, the flexible substrate comprises a plurality ofdiscrete members and step (b) comprises positioning each of the discretemembers on an outer portion of each of the first and second conduits.

In some embodiments, the activatable bonding agent is a thermallyactivatable bonding agent and the step of activating the bonding agentcomprises applying heat to the bonding agent.

In some embodiments, the step of applying heat to the bonding agentcomprises applying heat to the bonding agent from an external source.

In some embodiments, the external source comprises one or more of aresistive heating element, an exothermic reactive composition, aninfrared source or a microwave source.

In some embodiments, the step of applying pressure comprises positioningan apparatus comprising an inflatable member around an exterior surfaceof the flexible substrate and inflating the inflatable member and theapparatus includes the external heat source.

In some embodiments, the flexible substrate incorporates at least one ofa resistive heating element and an exothermic reactive composition andthe step of heating the bonding agent comprises activating the at leastone of the resistive heating element and the exothermic reactivecomposition.

In some embodiments, the first and second conduit sections comprise athermoplastic material that has a melting temperature and the heatingstep comprises heating the bonding agent to a temperature above amelting point of the bonding agent.

In some embodiments, the melting temperature of the bonding agent isless than the melting temperature of the first conduit section and thesecond conduit section and the method further comprises heating thebonding agent to a temperature less that the melting temperature of thefirst conduit section and the second conduit section.

In some embodiments, the activatable bonding agent is settable at roomtemperature and the step of activating the bonding agent comprisesexposing the bonding agent to the ambient.

In some embodiments, the activatable bonding agent is a thermallyactivatable bonding agent and the method further comprises applying heatto the bonding agent.

In some embodiments, the step of applying heat to the bonding agentcomprises applying heat to the bonding agent from an external source.

In some embodiments, the external source comprises one or more of aresistive heating element, an exothermic reactive composition, aninfrared source or a microwave source.

In some embodiments, the step of applying pressure comprises positioningan apparatus comprising an inflatable member around an exterior surfaceof the flexible substrate and inflating the inflatable member and theapparatus includes the external heat source.

In some embodiments, the flexible substrate incorporates at least one ofa resistive heating element and an exothermic reactive composition andthe step of heating the bonding agent comprises activating the at leastone of the resistive heating element and the exothermic reactivecomposition.

In some embodiments, the first and second conduit sections comprise athermoplastic material that has a melting temperature and the heatingstep comprises heating the bonding agent to a temperature above amelting point of the bonding agent.

In some embodiments, the melting temperature of the bonding agent isless than the melting temperature of the first conduit section and thesecond conduit section and the method further comprises heating thebonding agent to a temperature less that the melting temperature of thefirst conduit section and the second conduit section.

In some embodiments, the activatable bonding agent is settable at roomtemperature and the method further comprises exposing the bonding agentto the ambient.

In accordance with another broad aspect, there is provided a method forjoining a first conduit section having an open first end and an innersurface with a second conduit section having an outer surface, themethod comprising: a) inserting a first end of the second conduitsection in the open first end of the first conduit section with a gasketextending between the inner surface of the first conduit section and theouter surface of the second conduit section; b) positioning a firstflexible substrate on the first conduit section with an activatablebonding agent positioned between an inner side of the first flexiblesubstrate and an outer surface of the first conduit section; c)positioning a second flexible substrate on the second conduit sectionwith an activatable bonding agent positioned between an inner side ofthe second flexible substrate and an outer surface of the second conduitsection; d) applying pressure to the first flexible substrate wherebythe bonding agent is pressed against an outer surface of the firstconduit section while the bonding agent bonds to the outer surface ofthe first conduit section; and, e) applying pressure to the secondflexible substrate whereby the bonding agent is pressed against an outersurface of the second conduit section while the bonding agent bonds tothe outer surface of the second conduit section; and, f) securing thefirst and second flexible substrates together.

In some embodiments, each of the first and second flexible substratescomprises a connection member and the step of securing the first andsecond flexible substrates together comprises tensioning at least onetie member that engages each of the connection members.

In some embodiments, the at least one tie member comprises a pluralityof rigid connection members and the method further comprises tighteningeach of the rigid connection members.

In some embodiments, the at least one tie member comprises a flexibleelongate member and the method further comprises engaging the flexibleelongate member with the connection members and tensioning the flexibleelongate member.

In some embodiments, the first flexible substrate is secured in positionby an adhesive after the first flexible substrate has been positioned onthe first conduit section.

In some embodiments, the adhesive is a releasable adhesive whereby theadhesive is repositionable.

In some embodiments, the steps of applying pressure comprise positioningan inflatable member around an exterior surface of the flexiblesubstrate and inflating the inflatable member.

In some embodiments, the inflatable member comprises an inflatableannular member and the method further comprises sliding the inflatablemember along one of the conduit sections and positioning the inflatablemember to overlie at least a portion of the first or second flexiblesubstrate.

In some embodiments, the inflatable member comprises a longitudinallyextending member having a first portion that is securable to a secondportion and the method further comprises wrapping the longitudinallyextending member around at least one of the conduit sections andsecuring the first portion to the second portion such that theinflatable member overlies at least a portion of the first or secondflexible substrate.

In some embodiments, the first flexible substrate includes an inflatablemember and step (d) comprises inflating the inflatable member.

In some embodiments, the first flexible substrate comprises a pluralityof discrete members and step (b) comprises positioning each of thediscrete members on an outer portion of the first conduit section.

In some embodiments, the activatable bonding agent is a thermallyactivatable bonding agent and the steps of activating the bonding agentcomprise applying heat to the bonding agent.

In some embodiments, the steps of applying heat to the bonding agentcomprise applying heat to the bonding agent from an external source.

In some embodiments, the external source comprises one or more of aresistive heating element, an exothermic reactive composition, aninfrared source or a microwave source.

In some embodiments, the steps of applying pressure comprise positioningan apparatus comprising an inflatable member around an exterior surfaceof the flexible substrate and inflating the inflatable member and theapparatus includes the external heat source.

In some embodiments, the first flexible substrate incorporates at leastone of a resistive heating element and an exothermic reactivecomposition and the steps of heating the bonding agent compriseactivating the at least one of the resistive heating element and theexothermic reactive composition.

In some embodiments, the first and second conduit sections comprise athermoplastic material that has a melting temperature and the heatingsteps comprise heating the bonding agent to a temperature above amelting point of the bonding agent.

In some embodiments, the melting temperature of the bonding agent isless than the melting temperature of the first conduit section and thesecond conduit section and the method further comprises heating thebonding agent to a temperature less that the melting temperature of thefirst conduit section and the second conduit section.

In some embodiments, the activatable bonding agent is settable at roomtemperature and the step of activating the bonding agent comprisesexposing the bonding agent to the ambient.

It will be appreciated by a person skilled in the art that a method orapparatus disclosed herein may embody any one or more of the featurescontained herein and that the features may be used in any particularcombination or sub-combination.

These and other aspects and features of various embodiments will bedescribed in greater detail below. The apparatus and methods describedherein may be used to connect pipes and/or fittings of various materials(e.g. metallic pipes, thermoplastic pipes) to create piping systems fortransporting various liquids or gasses. It will be appreciated that thepiping system that uses the restraint member may be made from differentmaterials (e.g., the pipes may be made of PVC and/or CPVC and thefittings may be made of metal). Alternatively, the piping systemcomponents (or at least their inner surfaces through which fluid isconveyed) may be made of the same material.

Furthermore, the apparatus and methods may be applied to different sizesof piping, and/or piping systems made of the same or differentmaterials, and therefore may be applicable to piping systems fordomestic or commercial uses, such as conveying potable water,non-potable or waste water, or other liquids and/or gasses.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding of the described embodiments and to show moreclearly how they may be carried into effect, reference will now be made,by way of example, to the accompanying drawings in which:

FIG. 1 a is a perspective view of a pipe end positioned for installationwithin a T-fitting as is known in the prior art;

FIG. 1 b is a perspective view of a pipe end positioned for installationwithin a straight conduit as is known in the prior art;

FIG. 1 c is a perspective view of a pipe end positioned for installationwithin an elbow joint as is known in the prior art;

FIG. 2 is a perspective cross-section view of FIG. 1;

FIG. 3 is a perspective cross-section view of the pipe end and T-fittingof FIG. 1, with the pipe end inserted into the T-fitting;

FIG. 4 is a perspective view of the pipe end and T-fitting of FIG. 3secured using a traditional bolt-on collar;

FIG. 5 is a cross-section view of FIG. 4;

FIG. 6 is a perspective view of the pipe end and T-fitting of FIG. 3secured with a mechanical restraint member in accordance with oneembodiment of this disclosure;

FIG. 7 is a perspective cross-section view of FIG. 6;

FIG. 8 is a perspective view of the pipe end and T-fitting of FIG. 3secured with two or more mechanical restraint members in accordance withanother embodiment;

FIG. 9 is a perspective cross-section view of FIG. 8;

FIG. 10 is a cross-section view of a pipe end and a fitting secured inaccordance with another embodiment, with a transition collar positionedat the end face of the fitting;

FIG. 11 is a cross-section view of a pipe end and a fitting secured inaccordance with one embodiment, where the end face of the fitting isbeveled;

FIG. 12 is a cross-section view of a mechanical restraint member bondedto a pipe surface in accordance with one embodiment;

FIG. 13 is a cross-section view of another a mechanical restraint memberwith an outer protective layer bonded to a pipe surface;

FIG. 14 is a cross-section view of another embodiment of a mechanicalrestraint member with an outer protective layer bonded to a pipesurface;

FIG. 15 is a cross-section view of another embodiment of a mechanicalrestraint member with an embedded heating element bonded to a pipesurface;

FIG. 16 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with a flexible substrate being wrapped around thejoint in accordance with one embodiment;

FIG. 17 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with the flexible substrate of FIG. 16 and apressure cuff wrapped around the joint in accordance with oneembodiment, wherein the pressure cuff is in an un-inflated state;

FIG. 18 is a perspective cross-section view of FIG. 17, with thepressure cuff in an inflated state;

FIG. 19 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with a flexible substrate wrapped around the joint,the flexible substrate having an embedded resistive heating element inaccordance with another embodiment;

FIG. 20 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with the flexible substrate of FIG. 19 and apressure cuff wrapped around the joint in accordance with anotherembodiment, wherein the pressure cuff is in an un-inflated state;

FIG. 21 is a perspective cross-section view of FIG. 20, with thepressure cuff in an inflated state;

FIG. 22 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with the flexible substrate of FIG. 16 wrappedaround the joint, and with a heating blanket being wrapped around thejoint and the flexible substrate in accordance with another embodiment;

FIG. 23 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with the flexible substrate and heating blanket ofFIG. 22 and a pressure cuff wrapped around the joint in accordance withanother embodiment, wherein the pressure cuff is in an un-inflatedstate;

FIG. 24 is a perspective cross-section view of FIG. 23, with thepressure cuff in an inflated state;

FIG. 25 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with the flexible substrate of FIG. 16 wrappedaround the joint, and with a heat shrink being wrapped around the jointand the flexible substrate in accordance with another embodiment;

FIG. 26 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with the flexible substrate and heat shrink of FIG.25 and a pressure cuff wrapped around the joint in accordance withanother embodiment, wherein the pressure cuff is in an un-inflatedstate;

FIG. 27 is a perspective cross-section view of FIG. 28;

FIG. 28 is a perspective view of the pipe end and T-fitting of FIG. 3secured with a mechanical restraint member in accordance with anotherembodiment;

FIG. 29 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with the flexible substrate and heat shrink of FIG.25 wrapped around the joint, and with a heating blanket wrapped aroundthe heat shrink in accordance with another embodiment;

FIG. 30 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with the flexible substrate, heat shrink, andheating blanket of FIG. 29 and a pressure cuff wrapped around the joint,wherein the pressure cuff is in an un-inflated state;

FIG. 31 is a perspective cross-section view of FIG. 30, with thepressure cuff in an inflated state;

FIG. 32 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with two layers of flexible substrate and a heatshrink being around the joint, and a pressure cuff wrapped around thejoint and in an inflated state in accordance with another embodiment;

FIG. 33 is a perspective view of a sheet of flexible substrate with afirst bonding agent applied to substantially all of the sheet inaccordance with an embodiment;

FIG. 34 is a perspective view of the sheet of flexible substrate of FIG.33, with strips of a temporary adhesive applied to the bonding agent inaccordance with another embodiment;

FIG. 35 is a perspective view of the sheet of flexible substrate of FIG.33, with a second bonding agent applied around the first bonding agentin accordance with another embodiment;

FIG. 36 is a perspective view of a sheet of flexible substrate with afirst bonding agent applied in discrete strips in accordance withanother embodiment

FIG. 37 is a perspective view of the sheet of flexible substrate of FIG.36, with a second bonding agent applied around the first bonding agentin accordance with another embodiment;

FIG. 38 is a perspective view of a sheet of flexible substrate with afirst bonding agent applied in a pattern of discontinuous dots inaccordance with another embodiment;

FIG. 39 is an end-section of a pipe end with the sheet of flexiblesubstrate of FIG. 33 bonded to the pipe end in accordance with anotherembodiment;

FIG. 40 is an end-section of a pipe end with the sheet of flexiblesubstrate of FIG. 36 bonded to the pipe end in accordance with anotherembodiment;

FIG. 41 a is a top view of a sheet of the flexible substrate of FIG. 36,with a plurality of cutouts provided at each end, in accordance withanother embodiment;

FIG. 41 b is an end-section of a pipe end with the sheet of flexiblesubstrate of FIG. 41 a bonded to the pipe end in accordance with anotherembodiment;

FIG. 42 is a side view of a flexible substrate with an orientedcomponent aligned with a pipe end and a fitting in accordance withanother embodiment;

FIG. 43 is a perspective view of the pipe end and T-fitting of FIG. 3secured with a mechanical restraint member, the mechanical restraintmember having a visual pattern of thermochromic material in accordancewith another embodiment;

FIG. 44 is a schematic cross-section view of a pipe end and a fittingsecured in accordance with another embodiment;

FIG. 45 is a schematic cross-section view of a pipe end and a fittingbeing secured with an mechanical restraint member using a bondingapparatus in accordance with another embodiment;

FIG. 46 is a perspective view of a pipe end and T-fitting, with theflexible substrate of FIG. 16 wrapped around the joint, and a pipesecuring apparatus in accordance with one embodiment;

FIG. 47 is a perspective view of the pipe end and T-fitting of FIG. 46,with the pipe securing apparatus positioned over the flexible substratewherein the pipe securing apparatus is in an un-inflated state;

FIG. 48 is a perspective view of the pipe end and T-fitting of FIG. 46,with the pipe securing apparatus positioned over the flexible substratewherein the pipe securing apparatus is in an inflated state;

FIG. 49 is a perspective view of a pipe end and T-fitting, with theflexible substrate of FIG. 16 wrapped around the joint, and a pipesecuring apparatus in accordance with another embodiment;

FIG. 50 is a perspective view of the pipe end and T-fitting of FIG. 49,with the pipe securing apparatus wrapped around the flexible substrateand coupled to itself;

FIG. 51 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with the flexible substrate of FIG. 16 and a pipesecuring apparatus wrapped around the joint, with the pipe securingapparatus coupled to a source of pressure and to a source of power inaccordance with one embodiment, wherein the pipe securing apparatus isin an un-inflated state;

FIG. 52 is a perspective cross-section view of FIG. 51, with the pipesecuring apparatus in an inflated state;

FIG. 53 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with the flexible substrate of FIG. 16 and a pipesecuring apparatus wrapped around the joint, the pipe securing apparatushaving a plurality of infrared energy sources in accordance with anotherembodiment;

FIG. 54 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with the flexible substrate of FIG. 16 and a pipesecuring apparatus wrapped around the joint, the pipe securing apparatushaving a plurality of microwave energy sources in accordance withanother embodiment;

FIG. 55 is a perspective cross-section view of the pipe end andT-fitting of FIG. 3, with the flexible substrate of FIG. 19 and a pipesecuring apparatus wrapped around the joint in accordance with anotherembodiment, wherein heating element in the flexible substrate is coupledto a power source via the pipe securing apparatus;

FIG. 56 is a perspective view of a pipe end and T-fitting, with theflexible substrate of FIG. 16 wrapped around the joint, and a pipesecuring apparatus with a quality control module in accordance withanother embodiment;

FIG. 57 is a perspective view of the pipe end and T-fitting of FIG. 56,with the pipe securing apparatus wrapped around the flexible substrateand coupled to itself, with the pipe securing apparatus coupled to asource of pressure and to a source of power in accordance with oneembodiment;

FIG. 58 is an end view of FIG. 57, viewed along the axis of the joinedconduits;

FIG. 59 is a cross-section view of the pipe end and T-fitting of FIG. 3,with the flexible substrate of FIG. 16 and pipe securing apparatus ofFIG. 56 wrapped around the joint;

FIG. 60 is a schematic block diagram of control electronics for a pipesecuring apparatus with a quality control module in accordance with atleast one embodiment; and,

FIG. 61 is a flow diagram illustrating a sequence of events for using apipe securing apparatus with a quality control module to apply amechanical restraint member in accordance with at least one embodiment.

The drawings included herewith are for illustrating various examples ofarticles, methods, and apparatuses of the teaching of the presentspecification and are not intended to limit the scope of what is taughtin any way.

DESCRIPTION OF EXAMPLE EMBODIMENTS

Various apparatuses, methods and compositions are described below toprovide an example of an embodiment of each claimed invention. Noembodiment described below limits any claimed invention and any claimedinvention may cover apparatuses and methods that differ from thosedescribed below. The claimed inventions are not limited to apparatuses,methods and compositions having all of the features of any oneapparatus, method or composition described below or to features commonto multiple or all of the apparatuses, methods or compositions describedbelow. It is possible that an apparatus, method or composition describedbelow is not an embodiment of any claimed invention. Any inventiondisclosed in an apparatus, method or composition described below that isnot claimed in this document may be the subject matter of anotherprotective instrument, for example, a continuing patent application, andthe applicant(s), inventor(s) and/or owner(s) do not intend to abandon,disclaim, or dedicate to the public any such invention by its disclosurein this document.

The apparatuses, methods and compositions may be used with pipingsystems made of various materials. The piping system components, e.g.the pipes and/or fittings to be connected, may be made of concrete,fiberglass, a metal such as cast iron, steel, copper, stainless steel,titanium, zirconium and the like, and/or a plastic material (including athermoplastic material), such as polypropylene, polystyrene, nylon,polycarbonate, acrylonitrile butadiene styrene (ABS), PVC, CPVC,ethylene vinyl acetate (EVA), polyethylene (PE), high densitypolyethylene, ultrahigh molecular weight polyethylene or the like. Inone particular embodiment, the piping system components are made ofplastic. In one particular embodiment, the plastic is a thermoplasticmaterial.

The drawings exemplify the use of the restraint member to connect asection of pipe to a T-junction. It will be appreciated that the samerestraint member may be used to connect any parts of a piping systemtogether. For example, the restraint member may be used to connect twosections of pipe to each other, to connect a pipe with a fitting such asa valve, tees, couplers, elbows and the like, or to connect one fittingwith another fitting.

The drawings exemplify the use of the restraint member with pipingsystem components that are engaged using an insertion fit. It will beappreciated that other engagement systems, such as a butt joint, may beused

Typical Mechanical Joint Fitting

FIGS. 1 a to 3 illustrate an insertion fit, i.e., one end of one part ofa piping system (e.g. pipe 10) is inserted into an open end of anotherpart of the piping system (e.g. fitting 25). As exemplified, end 16 ofthe pipe 10 is inserted into opening 20 of fitting 25, which may be aT-junction as exemplified in FIG. 1 a, a straight conduit as exemplifiedin FIG. 1 b, an elbow joint as exemplified in FIG. 1 c, or any otherfitting.

Preferably, pipe end 16 and opening 20 are dimensioned so that there issufficient clearance between the outer surface 12 of pipe end 10 and theinner surface 24 of opening 20 to allow the pipe end to be insertedwithout requiring the application of undue axial force to pipe 10 and/orfitting 25. Typically clearances are provided in the American Societyfor Testing and Materials (ASTM) standards.

One or more annular gaskets 30 (e.g. O-rings) may be provided betweenouter surface 12 of pipe 10 and inner surface 24 of opening 20 to ensurea fluid-tight seal is provided. As shown in FIGS. 2 and 3, an annulargroove 23 may be provided on inner surface 24 of opening 20 to receivegasket 30 and to restrain the axial movement of gasket 30 duringinsertion of pipe 10. It will be appreciated that other alternativeconfigurations for providing a gasket between pipe 10 and fitting 25 maybe used. For example, a groove or other surface feature may be providedon the outer surface 12 of pipe 10, and gasket 30 may be positionedaround pipe 10 prior to its insertion into opening 20.

Fitting 25 may be configured such that an end 16 of a pipe 10 may beinserted only up to a predetermined distance into fitting 25. This mayassist in aligning one or more features (e.g. grooves, gaskets) of thefitting and/or the pipe end with each other. Therefore, a stop membermay be provided inside fitting 25. For example, as exemplified in FIG.2, in some embodiments fitting 25 may comprise an interior ridge 28 thatprovides an abutment surface against which a pipe end inserted intoopening 20 will abut when inserted a predetermined distance, to assistin coupling fitting 25 to a pipe end, as shown in FIG. 3. It will beappreciated that interior ridge 28 may have a height that is similar toor the same as the thickness of the pipe 10 inserted into opening 20.Accordingly, the cross sectional area of flow through the pipe and thefitting is generally the same.

If a liquid at a sufficiently high internal hydraulic pressures and/orsufficiently high flow rates is conveyed through pipe 10 and fitting 25,the joint must resist both forces imposed by the internal hydraulicpressure of the liquid (e.g. internal fluid pressure which tends toseparate the coupled components) and those forces imposed by a flowingmass of liquid within the piping system when it changes direction. Thesecombined forces tend to both separate the joint and to also force theliquid out of the joint. Thus, the components of the piping system (e.g.pipe 10 and fitting 25) should be restrained relative to each other toprevent their separation, and to maintain the integrity of the joint.

FIGS. 4 and 5 exemplify a mechanical joint fitting apparatus 40 forsecuring two components of a piping system, according to a known method.Generally, a ring-shaped member 41, 42 is secured to each of thecomponents (in this case fitting 25 and pipe 10, respectively), and thenthe ring-shaped-members are secured to each other to prevent the pipingsystem components from separating.

In the illustrated example, ring-shaped member 41 is formed by securingtwo semi-circular portions 41 a, 41 b to each other about fitting 25using one or more fastener 43, while ring-shaped member 42 is a unitaryring that is slid over pipe 10. The ring-shaped members 41, 42 aresecured to fitting 25 and pipe 10, respectively, using a plurality offasteners 44. Grooves or other recesses may be present on the outersurfaces 22, 12 of the fitting 25 and pipe 10, respectively at thepoints of contact 46 between the fasteners 44 and the piping systemcomponents. It will be appreciated that ring-shaped members 41, 42 maybe flanges that are integrally formed with fitting 25 and pipe 10.Finally, bolts 48 and nuts 49 are used to restrain the relative positionof the ring-shaped members 41, 42 to each other, and thus secure therelative position of pipe 10 and fitting 25.

While such an apparatus may be effective in securing the pipe andfitting (i.e. restraining the components from being separated), such anapparatus (and/or its method of installation) may have one or moredisadvantages as discussed previously.

Construction of a Mechanical Restraint Member

Reference is now made to FIGS. 6 to 15, which exemplify differentembodiments of a mechanical restraint member 100, each of which may bemade by (or used with) the methods disclosed herein. Mechanicalrestraint member 100 may be used by itself or with one or more of: theapplication method, the pipe securing apparatus 200, and the qualitycontrol module 300 disclosed herein.

Mechanical restraint member 100 includes a flexible substrate, referredto generally as 110, and a bonding agent 120 for securing the flexiblesubstrate 110 to components of the piping system that are to be securedto each other (i.e. restrained from separating), as will be discussedfurther subsequently.

Flexible substrate 110 may be made from any suitable material that hassufficient tensile strength to restrain the piping system componentsfrom separating due the anticipated outward axial forces imposed duringoperation of the piping system. For example, the tensile strength offlexible substrate 110 should be at least equal to the expected load(e.g. the total expected static and dynamic pressure in the pipingsystem during operation of the piping system, multiplied by the internalcross sectional pipe area). Preferably, the tensile strength of flexiblesubstrate 110 is between 1 to 5, 1.5 to 5, 1 to 1.5, or 3 to 5 times theexpected load, to provide an acceptable safety margin.

It will be appreciated that the flexible substrate may be made of one ormore of metal (e.g. a metal foil, a sheet of perforated metal, a metalmesh, and the like), a woven fabric, and a non-woven fabric. The wovenfabric and non-woven fabrics may comprise a natural or synthetic fiber.

If the flexible substrate is made of a solid member, e.g., a sheet ofmetal, then the sheet may be perforated so as to provide openingsthrough which the bonding agent may pass. Accordingly, the perforationsor other openings provide locations through which the bonding agent mayflow so as to increase the axial loads that may be restrained by therestraint member. For example, the bonding agent may flow through theopenings and surround or encase both axially extending sides of thesheet, thereby essentially immersing the sheet in the bonding agent.Once the bonding agent solidifies (e.g. sets) or cures, the bondingagent may be secured to both axially extending sides of the sheet andalso provide a solid member that extends through the openings to providean additional portion that inhibits axial movement.

Alternatively, the flexible substrate may be porous, such as a porousmaterial or a mesh material (e.g., woven metal wires or fibers, aplastic mesh, or the like). Once again, the bonding agent may flowthrough the pores or openings provided in the material.

In some cases, the bonding agent may not be able to flow through thesubstrate (e.g., the substrate is solid, or may have pores or openingsthat are too small to permit the bonding agent to enter into thesubstrate). In such a case, the adhesion between the inner surface ofthe substrate and the bonding agent provides the required mechanicalstrength to enable the mechanical restraint member to function.

If flexible substrate 110 is provided as a woven fabric, the weave mayor may not have an oriented component to provide enhanced tensilestrength of the flexible substrate 110 in one or more directions. Thiswould allow the flexible substrate 110 to be bonded to the joint with adirection of relatively high strength aligned with the direction of thehighest expected loading. For example, as illustrated in FIG. 42,flexible substrate 110 may have a first linear density, or linear massdensity, LD_(r) in the radial direction, and a second linear density, orlinear mass density, LD_(a) in the axial direction. This would allow theflexible substrate 110 to be bonded to the joint with a direction ofrelatively high strength (e.g. higher linear density) aligned with thedirection of the highest expected loading (e.g. axially).

Examples of suitable materials include metals (e.g., steel, stainlesssteel, aluminum, brass, copper, and the like), fiberglass (e.g. E-glass,S-glass, E-CR-glass), carbon fiber, aramid fiber (e.g. Kevlar™, Twaron),ultra-high-molecular-weight polyethylene (UHMWPE) (e.g. Spectra®,Dyneema®), polycarbonate, polypropylene, polyethylene, PVC, CPVC,Teflon™, and the like.

The fabric may have a thickness that provides sufficient tensilestrength based on the expected loading, while maintaining sufficientflexibility. For example, if the flexible substrate 110 comprisesS-glass, it may have a weight density in the range of 9-64 oz/ft², or18-36 oz/ft².

Flexible substrate 110 is provided with a first bonding agent 120. Thebonding agent may be applied to a surface of the flexible substrate orit may be impregnated therein. The bonding agent comprises a chemical orthermal bonding agent that is compatible with the first and secondconduits.

Bonding agent 120 may be a thermoplastic or a thermoset material, suchas polyurethanes (PUR), or reactive urethanes, polyesters,polyacrylates, methyl acrylates (solvented or unsolvented), latex-based,or gelatin-based adhesives.

Bonding agent 120 may be a thermally activated bonding agent. Suchbonding agents may be a plastic (e.g. a thermoplastic or a thermosetmaterial). Accordingly, the bonding agent may be a plastic that willmelt, at least partially, and adhere to the respective conduit.Accordingly, a thermally activated bonding agent may have the samecomposition as the conduit. Alternatively, it may be an adhesive that isactivated when heated so as to adhere to the conduit. The bonding agentmay comprises a thermal plastic urethane. Testing using the PolyurethaneReactive (PUR) EZ 250150 adhesive available from 3M showed acceptableperformance.

Bonding agent 120 may alternatively be a chemically activated bondingagent (e.g. a multi-component adhesive that forms an adhesive when thecomponents are combined), such as polyester resin/polyurethane resin,polyols/polyurethane resin, and acrylic polymers/polyurethane resincombinations, and the like.

It will be appreciated that some bonding agents may be activated orcatalyzed at least partly by modes other than thermal or chemicalactivation (e.g. at room temperature). For example, bonding agent 120may be a light curing adhesive, such as a UV curing adhesive, or amoisture curing adhesive, which may begin to cure in the presence ofmoist air. Accordingly, bonding agent 120 may be applied to flexiblesubstrate 110 in a controlled environment, such as a dry airenvironment, and packaged in a moisture and/or light impermeablecontainer, such as a sealed foil bag. Flexible substrate 110 may betransported and stored in such packaging, and only removed shortly orimmediately before use. For example, the bonding agent may be activatedby exposure to the ambient. For example, the bonding agent may be asolvent based adhesive which bonds to the conduit when the solventevaporates. In such a case, the bonding agent may be maintained in anair tight container until use.

Bonding agent 120 may be provided as a thin layer of material. Forexample, bonding agent 120 may have a thickness of from 0.002 to 0.250inches, more preferably from 0.005 to 0.080 inches, more preferably from0.010 to 0.040 inches, and most preferably from 0.015 to 0.025 inches.An advantage of this design is that a relatively small amount of heatmay be required to melt or activate the bonding agent and accordinglyonly the outer portion of the wall of the conduit may be melted.

In some embodiments, bonding agent 120 may have a melting or activationtemperature that is proximate that, and optionally less than, themelting temperature of the conduit to which it is applied. For example,the bonding agent may have a melting or activation temperature that isapproximately equal to, or from 100% to 110%, from 100% to 105%, or from100% to 102% of the melting temperature of the conduit to which it is tobe attached (wherein the percentage is a percentage of the meltingtemperature of the conduit). An advantage of this design is that onlythe outermost portion of the conduit will undergo slight melting andthis will limit the extent to which the pipe may be degraded by heating.For example, the conduit may have a wall thickness of, e.g., 0.5-1.5inches and only the outmost 25%, or 20%, or 15%, or 10%, or 2-5% of thewall may be heated above its melting point during bonding of theflexible substrate 110 to the conduit.

Alternatively, the bonding agent may have a melting or activationtemperature that is below the melting temperature of the conduit towhich it is to be attached, from 99% to 95%, from 95% to 90%, from 90%to 80%, or from 80% to 70% of the melting temperature of the conduit towhich it is to be attached. An advantage of this design is that theouter surface of the conduit my not undergo melting during the bondingprocess. It will be appreciated that, in other cases, the melting oractivation temperature may be substantially below the meltingtemperature of the conduit to which it is to be attached.

While the bonding agent may be provided on all portions of the innersurface of flexible substrate 110, it will be appreciated that, as willbe discussed further subsequently with respect to FIGS. 33-40, in someembodiments, bonding agent 120 may be provided only on portions of theinner surface of flexible substrate 110.

As shown in FIGS. 6 and 7, mechanical restraint member 100 may beapplied to the outer surfaces 12, 22 of two components of a pipingsystem (e.g., wrapped around the circumference of a joint between thetwo components), in this case pipe 10 and fitting 25, and bonded to aportion of the outer surfaces 12, 22 of each of the piping systemcomponents. More specifically, flexible substrate 110 has an outer side112, an inner side 114, and first and second ends 116, 118. All or aportion of the inner side 114 at the first end 116 is bonded to an outersurface of one of the components of the piping system (in this case, toouter surface 22 of fitting 25), and all or a portion of the inner side114 at the second end 118 is bonded to an outer surface of the othercomponent (in this case, to outer surface 12 of pipe 10). In this way,mechanical restraint member 100 prevents the components from separatingfrom each other.

As exemplified, a single sheet of mechanical restraint member 100 may bewrapped circumferentially around the joint. Accordingly, mechanicalrestraint member 100 may overlie all of the outer surfaces 12, 22 ofpipe 10 and fitting 25 at the location of the joint. It will beappreciated that in some embodiments, mechanical restraint member 100may be wrapped around the joint in more than one layer (e.g. 2 or 3layers) so that mechanical restraint member 100 will also overlieitself. In such a case, the same bonding agent as is used to secure themechanical restraint member to the conduit may be used. Alternatively,multiple layers of the substrate may be used (e.g., wrapped around aconduit). In such a case, substrate with bonding agent on an innersurface may be provided and wrapped around the joint. A layer ofsubstrate that has or is provided with a bonding agent suitable forsecuring one layer of the substrate to another layer of the substratemay then be wrapped around the joint on top of the existing substrate.Multiple such layers may be provided. It will be appreciated that thesubstrate of each layer may be the same or different.

Alternatively, as shown in FIGS. 8 and 9, mechanical restraint member100 may comprise one or more axially extending strips of flexiblesubstrate 110, each strip having a first end 116 bonded to an outersurface of one of the components of the piping system and a second end118 bonded to an outer surface of the other component. For example, 3,4, or more strips that are circumferentially spaced apart may be appliedin the axial direction.

It will be appreciated that the one or more gaskets 30 positionedbetween outer surface 12 of pipe 10 and inner surface 24 of opening 20provide the water-tight seal, while mechanical restraint member 100 actsto restrain the pie system components from separating, and notnecessarily to provide any sealing capabilities. Thus, while in someembodiments a continuous sheet of flexible substrate 110 may be wrappedaround—and bonded to—all (or substantially all) of the circumference ofthe joint, the primary function of the flexible substrate 110 is toprevent the joint from separating, although in some embodiments it mayprovide a back-up seal should a gasket 30 leak.

Since mechanical restraint member 100 is chemically bonded to the pipingsystem components, this significantly reduces (if not eliminates) therisk of plastic deformation, cracking, or other structural damage to thepiping system components during installation, as compared to, e.g. theapparatus illustrated in FIGS. 4 and 5.

Also, since the area of bonded contact of mechanical restraint member100 with the piping system components will generally be much greaterthan in prior art systems—c.f. the points of contact 46 in FIG. 4 withthe area of contact in FIG. 7 between inner surface 114 of flexiblesubstrate 110 and the outer surface 12 of pipe 10—structural issuesrelating to e.g. point loading may be substantially reduced oreliminated.

Optionally, a transition surface may be provided between the outersurfaces 12, 22, of the components 10, 25 being secured using mechanicalrestraint member 100. For example, FIG. 10 shows an example of atransition ring 90 positioned about pipe 10 and against end face 26 ofopening 20. Transition ring 90 has an outer transition surface 92 thatextends between outer surface 12 of pipe 10 and outer surface 22 ofopening 20. This outer transition surface 92 provides a less abrupttransition between the piping system components, which may facilitatesecuring and bonding flexible substrate 110 to surfaces 12, 22. Forexample, outer transition surface 92 may provide a continuous angled orcurved surface from outer surface 12 of pipe 10 to outer surface 22 offitting 25. Alternately, it may provide one or more step changes that ismore gradual than the single step change from outer surface 12 of pipe10 to outer surface 22 of fitting 25. An advantage of this design isthat the juncture of end face 26 and outer surface 22 will not provide asharp corner or transition that may cut into or fray substrate 110 overtime. The geometry provided by transition surface 92 may also reduce theshear forces on the bonding agent when the piping system components tryto move apart, as the force will be more parallel to, rather thanperpendicular to, the bonded flexible substrate 110, which may reducethe tendency for flexible substrate 110 to peel free of the componentsto which it is bonded. It will be appreciated that outer surface 92 mayhave a variety or profiles and need not extend all the way to the radialouter position of outer surface 12 of pipe 10 and/or all the way to theradial outer position of outer surface 22 of fitting 25. Alternativelyor additionally, as exemplified in FIG. 11, all (or at least a portionof) the end face 26 of opening 20 may be beveled to provide all or aportion of a transition surface 92 between outer surface 12 of pipe 10and outer surface 22 of opening 20 and accordingly a separate transitionring may not be provided.

Flexible substrate 110 may extend axially for a length L (see FIG. 7)along each conduit to which it is applied for any desired length. Itwill be appreciated that the stronger the bond between flexiblesubstrate 110 and the conduit, the smaller the overlap (length L) maybe. For example, the axial length of the bonded portion of the flexiblesubstrate 110 to a piping system component may be approximately equal tothe diameter of the piping system component (diameter D in FIG. 7) beingrestrained. It will be appreciated that this ratio may vary based onchanges in various parameters, e.g. the required tensile loadperformance, shear strength per unit area of the bonding agent, and thematerial of the outer surface of the piping system components beingrestrained. The ratio of the length of substrate secured to a conduit inthe axial direction (L) to the diameter of the conduit (D) may be about1:10 (i.e. L=0.1×D) or more, or about 1:5 or more, or from about 3:10 to1:2, or from 1:2 to 1:1.

FIGS. 12-15 illustrate various examples of possible configurations ofmechanical restraint member 100. Each example includes at least onelayer of flexible substrate 110 and a bonding agent 120. It will beappreciated that other variants are possible, depending on theapplication requirements (e.g. required tensile strength, expectedinstallation environment, etc.).

In one embodiment, the flexible substrate may be embedded in the bondingagent. Such an embodiment is exemplified in FIG. 12. As exemplifiedtherein, a sheet of flexible substrate 110 is bonded to a pipe 10 usingbonding agent 120. In the illustrated example, the flexible substrate110 is fully saturated/embedded in the bonding agent 120, so that thecured bonding agent may also act as a protective layer for theindividual fibers in the flexible substrate 110.

In some embodiments, a protective outer layer may be provided. Thisprotective layer is preferably environmentally inert, and protectsflexible substrate 110 and/or bonding agent 120 by providing a barrierto one or more environmental contaminants (e.g. ground water, acid rain,UV radiation, and the like). Accordingly, the protective layer may beselected to prevent or inhibit contact between the restraint member andgroundwater. Alternatively, or in addition, the protective layer may bea flexible protective polymer that has been impregnated with TiO₂ toprotect flexible substrate 110 and/or flexible protective polymer 130 afrom ultra-violet (UV) radiation). Exemplary protective layers maycomprise one or more of PVC, polyvinylidene difluoride (PVDF),polytetrafluoroethylene (PTFE), and the like.

The protective layer may be provided as part of the restraint member, orit may be a separate layer. For example, the protective layer may beformed on an outer surface of the flexible substrate. It may be appliedto the outer surface of the substrate prior to the application of thebonding agent (e.g. it may be poured or coated thereon, or it may havean inner adhesive side that is securable to the outer side of theflexible substrate). Alternatively, it could be a separate member thatis applied after the restraint member has been applied to the joint. Onesuch embodiment is exemplified in FIG. 13. As exemplified therein, theflexible substrate 110 is fully saturated/embedded in a flexibleprotective polymer 130, and the polymer-saturated flexible substrate 110is bonded to a pipe 10 using bonding agent 120. The protective layer mayextend beyond one or some or all of edges of flexible substrate 110 andcontact (or be bonded to) the outer surface of one or both componentsbeing joined.

Alternatively, as exemplified in FIG. 14, the outer side 112 of flexiblesubstrate 110 may be partially saturated/embedded in a flexibleprotective polymer 130 a, such as PVC, PVDF, PTFE, and the like, and theinner side 114 of flexible substrate 110 may be partiallysaturated/embedded in the bonding agent 120, or had the bonding agent120 applied thereto.

Also, as exemplified in FIG. 14, an optional additional protective layer130 b may be provided on the outer side of flexible protective polymer130 a. Alternatively, optional additional protective layer 130 b may beapplied to the outer surface of flexible substrate 110 of anyembodiment.

Optionally, a resistive heating member 142 (whose purpose will bediscussed further subsequently) may be incorporated into mechanicalrestraint member 100. As exemplified in FIG. 15, resistive heatingmember 142 may consist of electrically conductive fibers (e.g. Nichrome,Kanthal™, cupronickel, ceramic, carbon, and the like, and in someembodiments, may have a positive temperature coefficient (PTC))interwoven into a sheet of flexible substrate 110, or one or more wireotherwise embedded therein. Alternatively, resistive heating member 142may be provided adjacent, or at least near to, either side of flexiblesubstrate 110. It will also be appreciated that in some embodiments, theflexible substrate 110 itself may be electrically conductive, allowingflexible substrate 110 to act as a resistive heating member 142.

Method of Securing Two Pipe Members

FIGS. 16 to 40 exemplify methods and apparatus for securing pipingsystem components using a mechanical restraint member. In general, themethod includes connecting the piping system components using, e.g., aninsertion fit (with a gasket positioned between the components toprovide a water-tight seal), positioning a flexible substrate having abonding agent provided on at least an inner side of the flexiblesubstrate across the joint, and activating (e.g. heating) the bondingagent and applying pressure to the flexible substrate at least when thebonding agent is activated (e.g. at an elevated temperature) in order tobond the flexible substrate to the piping system components. It will beappreciated that the method may be used with any mechanical interface oftwo members of a piping system. The method may be used to apply amechanical restraint member 100, and may be used with pipe securingapparatus 200 and/or the quality control module 300 disclosed herein.

It will also be appreciated that the activation (e.g. the application ofheat) and the application of pressure may occur in any order providedthat the bonding agent is activated (e.g. at a temperature required forbonding (a bonding temperature)) when a pressure required for bonding (abonding pressure) is applied. Accordingly, the bonding agent may beraised to the bonding temperature, exposed to the ambient, formed bycombining two or more components, etc. prior to, concurrently with, orsubsequent to the bonding pressure being applied. Accordingly, variousdifferent constructs may be used to produce the bonding temperatureand/or apply the bonding pressure.

FIGS. 16 to 19 exemplify one embodiment of a method of applying amechanical restraint member to secure two components of a piping systemutilizing a pipe securing apparatus, which is also referred to herein asa pressure cuff, that incorporates a heating member. First, asillustrated in FIG. 16, the components are joined using an insertionfit, in this case by inserting pipe end 16 into opening 20 of fitting25. One or more gaskets 30 may be provided to provide a fluid-tight sealbetween the components, as discussed above. Once the components arepositioned as desired with any desired sealing system, a sheet offlexible substrate 110 is wrapped around all or a portion of the joint,so that all or a portion of inner surface 114 of flexible substrate 110at a first end 116 is in contact with an outer surface 22 of onecomponent (in this case fitting 25), and so that all or a portion ofinner surface 114 of flexible substrate 110 at a second end 118 is incontact with an outer surface 12 of the other component (in this casepipe 10). In this example, a bonding agent 120 has been applied to atleast a portion of the inner surface 114 of flexible substrate 110 ateach of the first and second ends 116, 118 prior to wrapping flexiblesubstrate 110 around the joint.

Flexible substrate 110 may be temporarily secured in position about thejoint using any suitable means. For example, one or more pieces of tapeor other fasteners (e.g. clamps, elastic bands, and the like) may beused to temporarily secure the sheet of flexible substrate 110 to thepiping system components, e.g. by applying a tape to both the outersurface 112 of flexible substrate 110 and the outer surface 12 or 22 ofthe piping system components. Alternatively, or additionally, where thesheet of flexible substrate 110 is wrapped around substantially all ofthe perimeter of the joint, a tape or other fastener may be applied tothe outer surface 112 of both longitudinal edges of the flexiblesubstrate 110, i.e. taping the flexible substrate 110 to itself. Otherfasteners (e.g. clamps, elastic bands, and the like) may alternativelyor additionally be used.

Alternatively, or additionally, an adhesive, which may be a temporary orreleasable adhesive, may be applied to all or a portion of inner surface114 of flexible substrate 110 (and/or to all or a portion of the bondingagent 120 applied to the inner surface 114 of flexible substrate 110) tosecure flexible substrate 110 in position while heat and pressure areapplied. Accordingly, the adhesive enables flexible substrate 110 to beplaced on the outer surfaces 12, 22 of the piping system components andto then remain in position. The temporary adhesive may be a releasableadhesive. An advantage of a releasable adhesive is that flexiblesubstrate 110 may be removed and repositioned (e.g., rewrapped) ifneeded. Such a temporary adhesive may comprise a low-tackpressure-sensitive adhesive, such as an elastomer (e.g. acrylic, butylrubber, EVA, natural rubber, nitrile, silicone rubber, styrene blockcopolymer (SBC), or vinyl ether and the like) compounded with a suitabletackifier.

Next, as illustrated in FIG. 17, a pressure cuff 200 (examples of whichwill be discussed further subsequently) is positioned around the sheetof flexible substrate 110 and, accordingly, around the perimeter of thejoint. Pressure cuff 200 may be of any construct that enables pressureto be applied to the outer surface of flexible substrate 110. It will beappreciated that, as exemplified, pressure cuff 200 may be positioneddirectly over (i.e., in contact with) flexible substrate 110.Alternatively, an intermediary member or members that will transmitpressure may be positioned between pressure cuff 200 and flexiblesubstrate 110, such as protective material 160 (e.g. a heat shrinkand/or environmentally inert material) or the like. As exemplified,pressure cuff 200 includes one or more inflatable pockets. For example,pressure cuff 200 may be an annular cuff having a singular continuousannular inflatable pocket that may be brought into position by slidingpressure cuff 200 over a free end of one component being joined (e.g.pipe 10) and then along the component until it overlies flexiblesubstrate 110. Alternatively, pressure cuff 200 may be a linear cuffthat has one or more inflatable pockets; the linear cuff is wrappedaround the joint and secured to itself to form an annular cuff. In theillustrated embodiment, pressure cuff 200 includes a heating element 210and a single annular inflatable pocket or pressure chamber s.

Once pressure cuff 200 is in position, it may be used to apply heatand/or pressure to flexible substrate 110 and bonding agent 120. Asillustrated in FIG. 18, pressure chamber 220 may be inflated to exertpressure on flexible substrate 110, and heating element 210 may beenergized to apply sufficient heat to activate bonding agent 120. Itwill be appreciated that the heat and pressure may be providedconcurrently, or in any order (i.e. heat then pressure, or pressure thenheat).

Pressure chamber 220 may be inflated by any means known in the art. Forexample, pressure chamber may have one or more fluid inlet ports.Accordingly, a pressure source, such as a compressor, a tank ofpressurized gas, or the like, may be connected to the inlet port. Itwill be appreciated that the inlet port may be used to subsequentlydepressurize the pressure cuff 200 and/or one or more fluid outlet portsmay be provided. Pressure chamber 220 may also be inflated by, e.g., gasreleased by a chemical reaction, or the like.

Heating element 210 may be any member that is capable of raising thebonding agent to the bonding temperature. As exemplified, heatingelement 210 comprises a resistive heating element 142. Resistive heatingelement 142 may be heated by an on-board power source (e.g., batteriesthat are provided in pressure cuff 200) or it may be connectable to anexternal source of current, such as by electrical contacts that may beprovided on pressure cuff 200 (similar to leads 144 shown in FIG. 19).In other embodiments, heating element 210 may comprise one or more of:an exothermic reactive composition; an infrared heat source; or otherradiant energy source (e.g. a microwave source) and the like. Forexample, pressure cuff 200 may incorporate one or more radiant energysources (e.g., IR emitters). These may be positioned around pressurecuff 200 so as to provide the required degree of heating. Alternatively,one or more radiant energy sources may be provided on only a portion ofpressure cuff 200, and pressure cuff 200 may be constructed to permitthe radiant energy sources to rotate around the joint to provide therequired degree of heating to all portions of the bonding agent.

Once activated by the application of heat by pressure cuff 200, bondingagent 120 begins forming a bond between flexible substrate 110 and thecomponents of the piping system 10, 25. Once bonding agent 120 has curedto provide a sufficient bond strength, pressure cuff 200 may be removed,leaving mechanical restraint member 100 in place to prevent components10, 25 from separating. It will be appreciated that while bonding agent120 may provide an initial bond strength (e.g. sufficient to allow theremoval of pressure cuff 200 without disturbing or displacing mechanicalrestraint member 100) after a relatively short period of time (e.g. from10, 20 or 30 minutes up to 1 or 2 hours and may be 10 to 30 minutes or20 to 30 minutes) the strength of bonding agent 120 may increase as thebonding agent continues to cure. For example, bonding agent 120 may takefrom between 12 hours to 1 week. For example, Polyurethane Reactive(PUR) EZ 250150 achieves 50% of its strength within 30 minutes, about75% of its strength after 12 hours, and 100% of its strength in about 7days.

FIGS. 19 to 21 exemplify another example of a method of applying amechanical restraint member to secure two components of a piping system.In this example, flexible substrate 110 has a resistive heating element142 woven into it. Resistive heating element 142 may be energized byapplying an electrical current to two or more leads 144. Otherwise, thismethod is similar to the method described with respect to FIGS. 16 to18. In accordance with this embodiment, pressure cuff 200 need not havea heating element. However, pressure cuff 200 may have a heating element210 as a backup, in case resistive heating element 142 of flexiblesubstrate 110 does not function correctly.

First, as illustrated in FIG. 19, the components are joined using aninsertion fit, with one or more gaskets 30 provided between thecomponents. Next, a sheet of flexible substrate 110 with an incorporatedresistive heating element 142 is wrapped around all or a portion of thejoint. As in the previous example, a bonding agent 120 has been appliedto at least a portion of the inner surface 114 of flexible substrate 110at each of the first and second ends 116, 118 prior to wrapping flexiblesubstrate 110 around the joint. Flexible substrate 110 may betemporarily secured in position about the joint as discussed above.

Next, as illustrated in FIG. 20, a pressure cuff 200 is positionedaround the sheet of flexible substrate 110 and around the perimeter ofthe joint. In the illustrated embodiment, pressure cuff 200 includes apressure chamber 220, but does not include a heating element. Oncepressure cuff 200 is in position, it may be used to apply pressure toflexible substrate 110 and bonding agent 120, while heating element 142may be energized to apply sufficient heat to activate bonding agent 120.As will be discussed further subsequently, heating element 142 may beenergized via pressure cuff 200. For example, leads 144 may be coupledto one or more electrical sockets or connectors located on pressure cuff200.

As above, once bonding agent 120 has cured to provide a sufficient bondstrength, pressure cuff 200 may be removed, leaving mechanical restraintmember 100 in place to prevent components 10, 25 from separating.

FIGS. 22 to 24 exemplify another example of a method of applying amechanical restraint member to secure two components of a piping system.In this example, after flexible substrate 110 has been positioned aboutthe joint between piping system components 10, 25, a heating blanket 150having a heating member (e.g. resistive heating element 142) maypositioned against the outer surface 112 of flexible substrate 110. Asillustrated in FIG. 22, the components are joined using an insertionfit, a sheet of flexible substrate 110 having a bonding agent 120applied to at least a portion of the inner surface 114 of flexiblesubstrate 110 at each of the first and second ends 116, 118 is wrappedaround all or a portion of the joint and may be temporarily secured inposition about the joint as discussed previously.

Next, a flexible heating blanket 150 is wrapped around all or a portionof the joint, so that all or a portion of inner surface 154 of heatingblanket 150 is in contact with the outer surface 112 of flexiblesubstrate 110. Heating blanket 150 may be temporarily secured inposition about the flexible substrate 110 using any suitable means. Forexample, heating blanket 150 may have one or more hook and loop (orother) fasteners so that once the heating blanket 150 is wrapped aroundsubstantially all of the flexible substrate 110, it may be secured toitself. Alternatively or additionally, any of the methods discussedpreviously with respect to temporarily securing flexible substrate 110about the joint may be used with heating blanket 150.

Once heating blanket 150 is in position, as illustrated in FIG. 23 apressure cuff 200 is positioned around the heating blanket and aroundthe perimeter of the joint. In the illustrated embodiment, pressure cuff200 includes a pressure chamber 220, but does not include a heatingelement. In accordance with this embodiment, pressure cuff 200 may havea heating element 210 as a backup, in case resistive heating element 142of heating blanket 150 does not function correctly. Once pressure cuff200 is in position, it may be inflated as shown in FIG. 24 to applypressure to flexible substrate 110 and bonding agent 120, while heatingelement 142 in heating blanket 150 may be energized to apply sufficientheat to activate bonding agent 120. As will be discussed furthersubsequently, heating element 142 may be energized via pressure cuff200. For example, heating element 142 may be electrically coupled to apower source via pressure cuff 200.

As above, once bonding agent 120 has cured to provide a sufficient bondstrength, pressure cuff 200 may be removed, leaving mechanical restraintmember 100 in place to prevent components 10, 25 from separating.

As discussed previously, mechanical restraint member 100 may compriseone or more optional protective layers on the outer surface of flexiblesubstrate 110. FIGS. 25 to 28 exemplify one example of a method ofapplying a mechanical restraint member with a protective layer. First,as illustrated in FIG. 25, the components are joined using an insertionfit, a sheet of flexible substrate 110 having a bonding agent 120applied to at least a portion of the inner surface 114 of flexiblesubstrate 110 at each of the first and second ends 116, 118 is wrappedaround all or a portion of the joint and temporarily secured in positionabout the joint as discussed above.

Next, a sheet of protective material 160 is applied to the outer surface112 of flexible substrate 110. For example, a protective layer maycomprise a heat shrink material, such as a thermoplastic material (e.g.polyolefin, fluoropolymer such as FEP, PTFE or the like, or PVC and thelike) may be provided.

As shown in FIG. 25, a sheet of a heat shrink material 160 may bewrapped around all or a portion of flexible substrate 110 so that all ora portion of inner surface 164 of heat shrink 160 is in contact with theouter surface 112 of flexible substrate 110. Heat shrink 160 may betemporarily secured in position about the flexible substrate 110 usingany suitable means, examples of which were discussed previously.

Next, as illustrated in FIG. 26, a pressure cuff 200 (examples of whichwill be discussed further subsequently) is positioned around the sheetof flexible substrate 110 and around the perimeter of the joint. In theillustrated embodiment, pressure cuff 200 includes a heating element 210and a pressure chamber 220. It will be appreciated that pressure cuff200 need not include a heating member is a heating member is providedusing one of the other constructs disclosed herein.

Once pressure cuff 200 is in position, it may be used to apply heatand/or pressure to heat shrink 160, flexible substrate 110, and bondingagent 120. For example, pressure chamber 220 may be inflated to exertpressure on heat shrink 160 and flexible substrate 110, and heatingelement 210 may be energized to apply sufficient heat to activate heatshrink 160 and bonding agent 120.

As above, once bonding agent 120 has cured to provide a sufficient bondstrength, and heat shrink 160 has shrunk to form a protective layer 130b, pressure cuff 200 may be removed, leaving the heat shrink-wrappedmechanical restraint member 100 in place to secure conduits 10, 25, asshown in FIGS. 27 and 28.

While in the methods described above, bonding agent 120 was thermallyactivated by an external heat source, in other embodiments the bondingagent may be heated using a heating member part or all of which isincorporated into flexible substrate 110. For example, flexiblesubstrate 110 may have bonding agent 120 applied to its inner side 114,and another composition provided on, e.g., outer side 112, this othercomposition capable of being activated by applying a catalytic agent(e.g. as a spray, or as another sheet of material applied to the outersurface 112 of flexible substrate 110) to initiate an exothermicreaction. Alternatively, the exothermically reactive compositions may beplaced is separate pockets which are rupturable to enable to reagents toreact and produce heat. For example, the pockets may be designed torupture when pressure cuff 200 is inflated (e.g., the walls of thepockets may be sufficiently thin such that they will rupture whenpressure is applied, or one or more piercing members may be provided tobreak an adjoining wall of the pockets when pressure is applied. Such anexothermic composition and catalyst may comprise components that achievea Grignard reaction (an organo-metallic chemical reaction), iron metalpowder and an oxidizer such as sodium chloride, and the like.

It will be appreciated that the features of mechanical restraint member100 and methods of applying mechanical restraint member 100 to securetwo component of a piping system may be used in any particularcombination or sub-combination.

For example, as illustrated in FIGS. 29 to 31, a mechanical restraintmember 100 may be applied by layering a flexible substrate 110, a shrinkwrap 160, and a heating blanket 150 about a joint, and using resistiveheating elements 142 in heating blanket 150 to apply heat while applyingpressure using pressure cuff 200.

Another example is shown in FIG. 32, where mechanical restraint member100 is applied by layering two flexible substrates 110 a, 110 bimpregnated with bonding agent 120, a layer of heat shrink 160, and thenusing a pressure cuff 200 having both a pressure cavity 220 and aheating element 210 to apply heat and pressure.

As previously noted, the bonding agent 120 of a mechanical restraintmember 100 may be provided on all or only on portions of the innersurface 114 of flexible substrate 110. Examples of various differentconfigurations of bonding agent 120 and flexible substrate 110 areexemplified in FIGS. 33-40. It will be appreciated that otherconfigurations may be possible, in variant embodiments.

In FIG. 33, a contiguous area of bonding agent 120 has been applied tosubstantially all of the inner surface 114 of a flexible substrate 110.It will be appreciated that bonding agent may be applied to all of innersurface 114.

In FIG. 34, a contiguous area of bonding agent 120 has been applied tosubstantially all of the inner surface 114 of a flexible substrate 110.Also, longitudinal strips of temporary adhesive 124 have been applied tothe surface of bonding agent 120, to assist in temporarily positioningflexible substrate 110 about the piping system components, prior toactivating the bonding agent 120.

In FIG. 35, a contiguous area of a first bonding agent 120 has beenapplied to substantially all of the inner surface 114 of a flexiblesubstrate 110. Also, a second bonding agent 122 has been applied aroundthe perimeter of the area to which the first bonding agent 120 has beenapplied. This second bonding agent 122 may be selected to have differentproperties than first bonding agent 120. For example, be second bondingagent 122 may be more resistant to chemical degradation from water. Thesecond bonding agent 122 may comprise an adhesive compatible with themechanical restraint member and the pipe system component and resistantto degradation from water such as one or more of a hot melt glue, anytype of adhesive which is inert e.g., a silicon based adhesive includingthose that are acetic acid or platinum reaction curing, and the like.

An advantage of providing a second bonding agent 122 around theperimeter of bonding agent 120 is that when a flexible substrate 110with this configuration of bonding agents is bonded to a piping system,the first bonding agent 120 may primarily provide the bond strengthnecessary to prevent the piping system components from separating, whilesecond bonding agent 122 may form a protective barrier around the firstbonding agent 120, preventing water or other environmental contaminantsfrom contacting and possibly degrading the bond formed by bonding agent120. Accordingly, the second bonding agent need not provide anyresistance to mechanical separation of the components of the joint.

As discussed previously, bonding agent 120 need not be appliedcontinuously over inner surface 114. For example, as shown in FIG. 36,strips of bonding agent 120 have been applied to the inner surface 114of a flexible substrate 110. In FIG. 37, each strip of bonding agent 120has been provided with a continuous perimeter of a second bonding agent122. FIG. 38 illustrates a pattern of discontinuous dots of bondingagent 120 that have been applied to the inner surface 114 of a flexiblesubstrate 110.

FIG. 39 illustrates an end section view of a pipe 10 to which a sheet offlexible substrate 110 has been bonded, where the bonding agent 120 wasapplied to substantially all of the inner surface 114 of flexiblesubstrate 110 prior to bonding (e.g. as shown in FIG. 33). Asexemplified, a continuous band of bonding agent 120 is providedcircumferentially around the joint. FIG. 40 illustrates an end sectionview of a pipe 10 to which a sheet of flexible substrate 110 has beenbonded, where the bonding agent 120 was applied in discrete strips tothe inner surface 114 of flexible substrate 110 prior to bonding (e.g.as shown in FIG. 36). As exemplified, a discontinuous band of bondingagent 120 is provided circumferentially around the joint.

It will be appreciated that flexible substrate 110 may be provided inany suitable shape. For example, flexible substrate 110 may be asubstantially planar sheet shaped so as to facilitate wrapping flexiblesubstrate 110 around a joint between two piping system conduits, wherethe joint has two or more different outer dimensions. For example, asillustrated in FIG. 41 a, one or more notches, grooves or the like maybe provided at the ends 116, 118 of flexible substrate 110. Accordingly,when wrapped around a pipe, the substrate may overlap itself less, oroptionally, there may be no overlap. In the illustrated example, thetotal width of first end 116 (i.e. W₁₁₆ _(a) +W₁₁₆ _(b) +W₁₁₆ _(c) +W₁₁₆_(d) ) may be substantially equal to the outer circumferential length ofone of the two piping system components being joined (e.g. junction 25)axially offset away from the widest part of the junction, the totalwidth of flexible substrate 110 (i.e. W₁₁₀) may be substantially equalto the outer circumferential length at the widest part of the junction,and the total linear width of second end 118 (i.e. W₁₁₈ _(a) +W₁₁₈ _(b)+W₁₁₈ _(c) +W₁₁₈ _(d) ) may be substantially equal to the outercircumferential length of the other of the two piping system componentsbeing joined (e.g. pipe 10) axially offset from the widest part of thejunction. In this way, when flexible substrate 110 is wrapped around thejoint between components 10, 25 (i.e., the flexible substrate is wrappedin the width direction circumferentially around a joint), most orpreferably all of inner face 114 of flexible substrate 110 may liesubstantially flush with the outer surface of the components to which itis being bonded, as illustrated in FIG. 41 b. It will be appreciatedthat notches may be provided at one end, at both ends, or at neitherend.

Optionally, the outer surface of mechanical restraint member 100 may beprovided with a material that undergoes a visually observable changewhen heated, e.g. a thermochromic substance such as leuco dyes, liquidcrystals, and the like. The use of such a material may allow a visualindication that the outer surface of flexible substrate 110 was raisedto a certain temperature (i.e. the transition temperature at which thethermochromic material changes colour), which may be used to infer thatsufficient heat was applied to flexible substrate 110 during the bondingprocess to activate a thermally-activated bonding agent. It will beappreciated that the thermochromic material may be selected and/ormodified to provide a colour change at predetermined temperature (e.g.100%, or from 100% to 110%, or higher than 110% of the temperaturerequired to activate bonding agent 120).

A thermochromic material may be applied to substantially all of theouter surface of flexible substrate 110. Thus, a colour change could beobserved to confirm that substantially all of flexible substrate 110reached the predetermined. Alternatively, or additionally, athermochromic substance 170 may be applied in a pattern such as thepattern exemplified in FIG. 43, to reduce the amount of thermochromicmaterial required and/or to locate the thermochromic material at areasof greater importance—for example, where discontinuous strips of bondingagent 120 are applied to the inner surface 114 of flexible substrate 110(see e.g. FIG. 36), thermochromic material 170 may only be applied atcorresponding locations on outer surface 112.

As discussed previously, a mechanical restraint member 100 may be bondedto a portion of the outer surfaces 12, 22 of each of the piping systemcomponents, thereby restraining the components from separating (see e.g.the embodiments illustrated in FIGS. 6 to 9). In an alternativeembodiment, two piping system components may be restrained by bondingone or more securement members to the outer surfaces of each of thepiping system components using a bonding agent, and then mechanicallycoupling the securement member(s) bonded to one component to thesecurement member(s) bonded to the other component. For example, one ormore mechanical restraint members according to any embodiment herein,each of which may have one or more securement members, may be bonded toone component and one or more mechanical restraint members according toany embodiment herein, each of which may have one or more securementmembers, may be bonded to the other component. Once bonded, thesecurement members may be mechanically coupled together therebyinhibiting the outward axial movement of one component with respect tothe other component of the joint. The securement members act as aninterface between the flexible substrate that has been bonded to thepiping system component and a mechanical coupling mechanism that is usedto mechanical couple two or more securement members to each other.Examples of securement members include eyelets, hooks, posts, and thelike affixed to an outer surface of the flexible substrate, openingsprovided in the flexible substrate itself and the like. The securementmembers may be mechanically coupled or otherwise engaged to each otherusing any suitable means, such as using a flexible elongate tie membere.g., wire or rope made of metallic (e.g., steel, brass, copper and thelike) or non-metallic members, which may be natural and/or syntheticfibers (such as glass fiber, aramid fiber, polypropylene fiber, carbonfiber), chains, and/or rigid tie members such as mechanical fasteners(e.g. bolts, screws, and the like), turnbuckles, and the like. The tiemembers may optionally be tensioned during or after their coupling tothe securement members. It will be appreciated that any suitablecombination of securement member and mechanical fastener may be used.

In the example illustrated in FIG. 44, components 10, 25 have beenjoined using an insertion fit, as discussed previously. A piece offlexible substrate 110 to which a securement member 180 is secured isbonded to the outer surface 22 of conduit 25, and another piece offlexible substrate 110 to which a securement member 180 is secured isbonded to the outer surface 12 of conduit 10. Securement members 180 aremechanically coupled to each other to restrain the securement members(and thereby the pipe system components to which they are bonded) in theaxial direction. It will be appreciated that securement members 180 maybe the same or different. For example, securement members bonded to onecomponent may have a threaded bore for receiving the threaded end of amechanical fastener 182 (e.g. a screw or bolt), while securement membersbonded to the other component may have a plain bore. In this way,mechanical fastener 182 (e.g. a screw or bolt) may be inserted throughone securement member, and threaded into another securement member.

It will be appreciated that the securement members may be attached tothe flexible substrate prior to the flexible substrate being bonded tothe component. However, in other embodiments, the securement members maybe attached to the flexible substrate concurrently with the flexiblesubstrate being bonded to the component or thereafter.

In another variant embodiment, mechanical restraint member 100 may beapplied to the pipe system components to be restrained by positioning aflexible substrate across the joint, and injecting a bonding agentthrough or around the flexible substrate to bond the flexible substrateto the piping system components. In other words, a flexible substrate ispositioned across the joint, and a bonding agent is injected in situ.

For example, as illustrated in FIG. 45, components 10, 25 have beenjoined using an insertion fit, as discussed previously. Flexiblesubstrate 110 is positioned on the outer surface of the components tooverlie the joint between components 10, 25. Once flexible substrate 110is in position, a bonding apparatus may be used to inject a bondingagent through the flexible substrate 110 (e.g. through the openings in aperforated substrate or through the pores in a woven flexible substrate110) so that the bonding agent is operable to bond flexible substrate110 to the piping system components. For example, the bonding apparatusmay have one or more heads 190 for applying pressure to flexiblesubstrate 110 (e.g. to maintain flexible substrate 110 in positionduring the injection of bonding agent 120, and/or to act as a sealagainst the outer surface 112 of flexible substrate 110 to force bondingagent 120 into the flexible substrate 110). One or more injectionpassages 192 may be provided through heads 190 for delivering bondingagent 120 to flexible substrate 110. In some embodiments, one or moreheads 190 may be incorporated into the inner surface of a pipe securingapparatus, as will be discussed subsequently.

Pipe Securing Apparatus

Reference is now made to FIGS. 46 to 55, which exemplify differentembodiments of a pipe securing apparatus 200, each of which may be usedwith the methods disclosed herein. Pipe securing apparatus 200 may alsobe referred to as a pressure cuff. Pressure cuff 200 may be of anyconstruct that enables pressure to be applied to the outer surface offlexible substrate 110. Pipe securing apparatus 200 includes one or morepressure chambers, referred to generally as 220, and may include one ormore heat producing elements, referred to generally as 220, as will bediscussed further subsequently. Pipe securing apparatus 200 may be usedwith one or more of mechanical restraint member 100, the applicationmethod, and the quality control module 300 disclosed herein.

FIGS. 46 to 48 exemplify one embodiment of a pipe securing apparatusthat may be used in applying a mechanical restraint member to secure twocomponents of a piping system. As exemplified in FIG. 46, pressure cuff200 is an annular cuff sized to fit over at least one end of a componentto be joined, and having an outer surface 212 and an inner surface 214.Pressure cuff 200 may be brought into position by sliding pressure cuff200 over a free end of one component being joined (e.g. pipe 10) andthen along the component until it overlies flexible substrate 110 and,accordingly, around the perimeter of the joint. Once pressure cuff 200is in position, as shown in FIG. 47, it may be used to apply pressureand/or heat to flexible substrate 110 and bonding agent 120. Asillustrated in FIG. 48, one or more pressure chambers—e.g. a singularcontinuous annular inflatable pocket (not shown)—may be inflated toexert pressure on flexible substrate 110, and a heating element may beenergized to apply sufficient heat to activate bonding agent 120.

An alternate embodiment of a pipe securing apparatus that may be used inapplying a mechanical restraint member to secure two components of apiping system is exemplified in FIGS. 49 and 50. As illustrated in FIG.49, pressure cuff 200 is an linear cuff having an outer surface 212, aninner surface 214, a first end 218, and a second end 218. This linearpressure cuff 200 may be brought into position by wrapping pressure cuff200 around flexible substrate 110 and, accordingly, around the perimeterof the joint, bringing at least a portion of inner surface 214 incontact with flexible substrate 110. Once pressure cuff 200 is inposition, it may be secured to itself using one or more mechanicalfasteners, which may be part of pressure cuff 200 or may be a separatemember, examples of which include belts and corresponding buckles(including friction buckles), hook and loop fasteners, hook-and-eyeclosures, zippers, snap fasteners, lacing, the like. In the illustratedexample, belts 242 located at first end 216 of pressure cuff 200 maycooperate with a buckle 240 located at the second end 218 to releasablycouple the first and second ends to each other. It will be appreciatedthat mechanical fasteners may be provided at a plurality of locations atone or both ends 216, 218, so as to allow the ends to be connected toprovide an open interior of varying diameters.

Once pressure cuff 200 is in position, it may be used to apply pressureto flexible substrate 110 and bonding agent 120. As illustrated in FIGS.51 and 52, a pressure chamber 220 may be inflated to exert pressure onflexible substrate 110. Pressure chamber 220 may be inflated by anymeans known in the art. For example, pressure chamber may have one ormore fluid inlet ports 222. Accordingly, a pressure source 280, such asa compressor, a tank of pressurized gas, or the like, may be connectedto the inlet port 222. It will be appreciated that the inlet port may beused to subsequently depressurize the pressure cuff 200 and/or one ormore fluid outlet ports may be provided. Pressure chamber 220 may alsobe inflated by, e.g., a fluid pumped into the pressure chamber 220, gasreleased by chemical reaction, or the like. The fluid may be a heatedfluid. Accordingly, the fluid may supplement or be the heating member.For example, the fluid (liquid and/or gas) may be continually circulatedin a loop (e.g., into a heat exchanger and then into the pressurechamber prior to being returned to the heat exchanger) to continuallysupply heat to the pressure chamber 220. Alternately, a mechanical orelectromechanical turnbuckle, electro- or magneto-constrictive wires orother exterior constriction member could be used to supplement orreplace the pressure chamber 220.

In some embodiments, pressure cuff 200 may also include a heat producingmember, such as a heating element 210 to apply heat to flexiblesubstrate 110 and bonding agent 120, e.g. to raise the temperature ofbonding agent to or past its activation temperature, thus initiatingbonding between flexible substrate 110 and the piping conduits beingjoined. Heating element 210 may be any member that is capable of raisingthe bonding agent to the bonding temperature. As exemplified, heatingelement 210 comprises a resistive heating element 142. Resistive heatingelement 142 may be energized by an on-board power source (e.g.,batteries that are provided in pressure cuff 200), or it may beconnectable to an external power source 290, such as by electricalcontacts or terminals that may be provided on pressure cuff 200 (similarto leads 144 shown in FIG. 19). In other embodiments, heating element210 may comprise a radiant energy source, such as an infrared (IR)source, a microwave source, and the like. For example, pressure cuff 200may incorporate one or more IR emitters 146 (as shown in FIG. 53), orone or more microwave emitters 148 (as shown in FIG. 54), or acombination of radiant energy sources. These may be positioned aroundpressure cuff 200 so as to provide the required degree of heating.Preferably, radiant emitters are provided on (or proximate) innersurface 214 of pressure cuff 200, to facilitate energy transfer toflexible substrate 110. Alternatively, heating element 210 may comprisea chemical source of heat, such as chambers containing components that,when the chambers are ruptured and the components mixed, form anexothermic mixture, and the like.

Alternatively, pressure cuff 200 may not include a heating element 210,but may nonetheless be used to apply heat to flexible substrate 110 andbonding agent 120. For example, a pressure cuff 200 may lack an internalheating element, but may provide one or more electrical contacts toenergize a resistive heating element located external to pressure cuff200. As illustrated in FIG. 55, such a pressure cuff may be used inconfigurations where flexible substrate 110 has an embedded resistiveheating element (see e.g. FIGS. 19 and 20). In such a configuration, theresistive heating element 142 may be coupled to a source of power, suchas external power source 290, via wiring 211 located within pressurecuff 200. In other words, a resistive heating element 142 located ine.g. flexible substrate 110, heating blanket 150, or heat wrap 160, maybe ‘plugged in’ to pressure cuff 200.

Pipe securing apparatus 200 may be made from any suitable material thathas sufficient tensile strength to withstand the anticipated forcesimposed by the inflation of the pressure chamber(s) 220 during operationof the pressure cuff. Preferably, the inner face of pressure cuff 200(i.e. the surface that contacts flexible substrate 110 when used toapply heat and/or pressure to flexible substrate 110) comprises amaterial that bonding agent 120 does not bond to (or does not stronglybond to) to e.g. facilitate removal of pressure cuff 200. Examples ofsuch anti-stick agents include Teflon, PVDF, ultrahigh molecular weightpolyethylene, a fluropolymer, a mixture of titanium and ceramic and thelike.

Quality Control Apparatus

Reference is now made to FIGS. 56 to 59, which exemplify differentembodiments of a pipe securing apparatus 200 having an optional qualitycontrol module 300. Such an apparatus may be used with the methods,mechanical restraint member 100, and/or pipe securing apparatus 200disclosed herein. Quality control module 300 may be used to determineand/or record one or more physical parameters during or after theapplication of a mechanical restraint member 100 to a piping system, toprovide data to an operator during or after operation of a pipe securingapparatus 200 so as to advise a user or allow a user to determine thatthe pipe securing apparatus 200 is operating correctly and/or that thepipe securing apparatus is or was used correctly, and/or to provide anauditable record of the use of pipe securing apparatus 200 and/or theapplication of one or more mechanical restraint members to a pipingsystem. It will be appreciated that quality control module 300 need notbe part of pipe securing apparatus 200 but may be a separate unit.

Quality control module 300 may include one or more sensors—such as atemperature sensor, pressure sensor, optical sensor, continuity sensor,force sensor, and/or location sensor—for determining one or moreoperational parameters before, during, and/or after the application of amechanical restraint member 100.

For example, quality control module 300 may have one or more temperaturesensors, such as an infra-red (IR) thermometer, a thermocouple, athermistor and the like, that may be located, e.g., on the inner surfaceof a pipe securing apparatus 200, and configured to measure a surfacetemperature of an object (e.g. a pipe or a housing to which a mechanicalrestraint member 100 is being applied, a flexible substrate, a heatingblanket, etc.). A signal representing the temperature of the object maybe indicative of an adjacent object. For example, the temperature of theouter surface 112 of flexible substrate 110 may be indicative of thetemperature of a bonding agent on the inner surface 114 of the flexiblesubstrate 110.

Alternatively, or additionally, quality control module 300 may have oneor more pressure sensors such as a pressure transducer, a piezoelectrictransducer and the like, operable to measure the pressure being appliedby a pipe securing apparatus 200 to a flexible substrate 110. Forexample, a pressure sensor may be located in fluid communication withone or more pressure chambers 220 of pipe securing apparatus 200. Asignal representing an increase in the internal pressure of pressurechambers 220 may be indicative of the pressure being applied by pipesecuring apparatus 200 to a flexible substrate 110. Other suitablepressure sensors may be used, such as or one or more strain gaugeslocated on e.g. the inner surface of a pipe securing apparatus 200.

Alternatively, or additionally, quality control module 300 may have oneor more optical sensors operable to determine a colour and/or a colourchange of flexible substrate 110. For example, one or more opticalsensors may be located on the inner surface of a pipe securing apparatus200. A signal representing a colour and/or a change in colour of all ora portion of the outer surface 112 of flexible substrate 110 may beindicative of a thermochromic material applied thereon changing colourin response to flexible substrate 110 (and, by proxy, bonding agent 120)reaching a predetermined temperature, such as the activation temperatureof bonding agent 120.

Alternatively, or additionally, quality control module 300 may have oneor more location sensors such as a GPS (Global Positioning System)locator and the like, operable to determine a location of qualitycontrol module 300 and/or pipe securing apparatus 200. For example, aGPS may comprise a GPS receiver or transceiver for communicating with aGPS satellite network to determine a geographic location of qualitycontrol module 300. Accordingly, the location at which quality controlmodule 300 and/or pipe securing apparatus 200 is used may be recordedalong with the data provided by the other sensors.

Alternatively, or additionally, quality control module 300 may have oneor more continuity sensors. Continuity sensor may be used, e.g., with alinear pressure cuff. Continuity sensors may be utilized to determineif, e.g., the pressure cuff has been wrapped around the pipe (e.g., thedistal end of the linear pressure cuff may be looped or connected to theproximate end as exemplified in FIG. 50). Alternately, or in addition, acontinuity sensor may be used to determine if the pressure cuff is insufficient contact with the conduits such that the pressure cuff willapply pressure to the conduits when used (e.g., by determining if anelectric current will be conveyed around the pressure cuff).

Alternatively, or additionally, quality control module 300 may have oneor more force sensors, such as a piezoelectric transducer, force sensingresistor and the like, to measure the force, e.g., applied by thepressure cuff at the outer surface 112 of the substrate.

Quality control module 300 preferably includes control electronics 310operatively coupled to the sensors and/or other electrical components ofpipe securing apparatus 200. For example, control electronics 310 may becoupled to heating element 210 and/or one or more temperature sensors(not shown) to regulate and/or record the heat being applied to flexiblesubstrate 110, and/or the surface temperature of flexible substrate 110.

Control electronics 310 may also be operatively coupled to one or moresignaling members to convey information to a user of pipe securingapparatus 200 regarding the status of one or more monitored conditions.For example, a display screen 350 may be provided to provide anindication that flexible substrate 110 has reached a suitabletemperature to activate bonding agent 120. Display screen 350 may alsoprovide an indication that a sufficient amount of pressure is or hasbeen applied to flexible substrate 110 to promote a good bond betweenflexible substrate 110 and the piping system components.

Display screen 350 may be any suitable display device, such as, forexample, a liquid crystal display (LCD), a segment display, an OrganicLED (OLED) display, a light emitting diode (LED) display, or anelectrophoretic display. Display screen 350 may also be a touch screendisplay, capable of receiving input from a user.

Other signaling members may be provided as an alternative to, or inaddition to, display screen 350. For example, an audio signalling membersuch as an electroacoustic transducer (or speaker) may be configured toprovide an audible tone in response to a sensor detecting that apredetermined temperature and/or pressure has been reached, and/or whenotherwise directed by control electronics 310. As another example, oneor more indicator lights (such as LEDs) may be provided on qualitycontrol module 300 and configured to emit a signal (e.g. illuminate,strobe, and/or change colour) in response to detecting that apredetermined temperature and/or pressure has been reached, and/or whenotherwise directed by control electronics 310. For example, one or morepower indicator lights (not shown) may be provided to convey informationto a user regarding the status of a power source (e.g. a battery)coupled to pipe securing apparatus 200.

Control electronics 310 may also comprise a data logging module 320 forlogging or recording data related to one or more sensors and/oroperations of pipe securing apparatus 200. For example, the data loggingmodule may record data corresponding to an amount of heat applied byheating element 210, a temperature reached by flexible substrate 110, apressure applied by pressure chambers 220, a location of pipe securingapparatus 200 during use, and this information may be time stamped orotherwise tagged to provide an output, e.g., of the number of mechanicalrestraint member's applied per hour or per shift, and/or the locationsat which they were applied. The data logging module may also record datacorresponding to a number of signals issued by a signaling member.

The data logging module may also record operational parameters one ormore components of pipe securing apparatus 200, such as temperaturereadings from heating element 210, electrical current draw by resistiveheating element 142, pressure data from a pressure sensor within or incommunication with pressure chamber 220, temperature data from an IRthermometer, etc.

The data logging module may also include a timing module (not shown),and be configured to record data corresponding to the time(s) at which apipe securing apparatus 200 was used to apply heat and/or pressure to aflexible substrate 110, which may be an absolute time (e.g. 12:00 am onMay 24), and/or a relative time (e.g. 20 minutes since the last timepipe securing apparatus was used, and/or a duration (i.e. a period oftime, e.g. 8 minutes) of an application of heat and/or pressure by pipesecuring apparatus 200). Time information may also be recorded for otheroperational parameters, such as when pipe securing apparatus 200 wasturned on and off and/or the length of time of each step in theoperation, such as the length of time that heat and/or pressure isapplied.

In this way, the data logging module may be operable to record adetailed log of the use of the tool throughout a predetermined timeperiod, such as a working day, work week, or throughout a particularpiping system installation project.

Control electronics 310 may be configured to display some or all of thelogged data on display screen 350. Alternatively, or additionally,control electronics may comprise a communications module 330 configuredto establish a communication channel between the data logging module andremote device, e.g., a computing device, such as a laptop computer,tablet computing device, mobile communication device, remote server,etc. The communication channel may be established by the communicationmodule using any suitable wired or wireless protocol, and may beconfigured as a personal area network (PAN), a point-to-point network,or any other suitable network topology. Wired communication may beconducted in accordance with Universal Serial Bus (USB) standards, andpipe securing apparatus 200 may be provided with a Standard, Mini, orMicro USB port (not shown). Examples of wireless communication includestandards developed by the Infrared Data Association (IrDA), Near FieldCommunication (NFC), and the 803.11 family of standards developed by theInstitute of Electrical and Electronics Engineers (IEEE). In someembodiments, a relatively short-range wireless communications protocolsuch as Bluetooth® or Wireless USB may be used.

The communications module may be configured to transmit some or all ofthe recorded data to the computing device over the communicationchannel, as the data is recorded or subsequent thereto, so that datalogged by pipe securing apparatus 200 may be reviewed, stored, and/oraudited. For example, data logged by pipe securing apparatus 200 may beaudited to confirm that one or more mechanical restraint members wereapplied correctly. The logged data may also be compared with aninstallation plan for a piping system being assembled, to confirm thatthe total number of mechanical restraint members actually applied usingpipe securing apparatus 200 corresponds with the total number ofmechanical restraint members required to be applied to correctly installthe piping system and/or that the pipe securing apparatus 200 was usedat the location of some or all of the joints.

Reference is next made to FIG. 60 illustrating a block diagram ofcontrol electronics 310 in accordance with an example embodiment.Control electronics 310 are provided as an example and there can beother embodiments of control electronics 310 with different componentsor a different configuration of the components described herein.

Control electronics 310 comprises processing unit 302, display 350, userinterface 304 (e.g. for receiving control instructions for the heatingelement 210 and/or pressure chamber 220), and other input/output (I/O)hardware 306, communications unit 308 (which may include wireless unit309), power unit 312 and memory unit 314.

Processing unit 302 controls the operation of the pipe securingapparatus 200 and/or quality control module 300. Processing unit 302 canbe any suitable processor, controller or digital signal processor thatcan provide sufficient processing power processor depending on theconfiguration, purposes and requirements of quality control module 300as is known by those skilled in the art. For example, processing unit302 may be a high performance general processor. In alternativeembodiments, processing unit 302 can include more than one processorwith each processor being configured to perform different dedicatedtasks. In alternative embodiments, specialized hardware may be used toprovide some of the functionality provided by processing unit 302.

Display 350 can be any suitable display that provides visual informationdepending on the configuration of quality control module 300. Forinstance, display 350 can be a display suitable for a laptop, tablet, orhandheld device such as an LCD-based display and the like.

User interface 304 can include at least one of a keyboard, a touchscreen, a thumbwheel, a track-pad, a track-ball, and the like againdepending on the particular implementation of quality control module300. In some cases, some of these components can be integrated with oneanother.

Communications unit 308 can be any interface that allows the qualitycontrol module 300 to communicate with other devices or computers. Insome cases, the communications unit 308 can include at least one of aserial port, a parallel port or a USB port that provides USBconnectivity. Wireless unit 309 is optional and can be a radio (e.g. atransceiver or a transmitter) that communicates utilizing CDMA, GSM,GPRS or Bluetooth protocol according to standards such as IEEE 802.11a,802.11b, 802.11g, or 802.11n. Wireless unit 309 can be used by qualitycontrol module 300 to wirelessly communicate with other devices orcomputers.

I/O hardware 306 generally includes a temperature sensor, pressuresensor, optical sensor, and location sensor, or any other suitablesensor(s). I/O hardware 306 may optionally also include at least one ofa microphone, a speaker, and a printer, for example.

Power unit 312 can be any suitable power source that provides power topipe securing apparatus 200 and/or quality control module 300 such as apower adaptor or a rechargeable battery pack depending on theimplementation of pipe securing apparatus 200 as is known by thoseskilled in the art.

Memory unit 314 can include RAM, ROM, one or more hard drives, one ormore flash drives or some other suitable data storage elements such asdisk drives, etc. Memory unit 314 may be used to store an operatingsystem and programs as is commonly known by those skilled in the art.For instance, an operating system may provide various basic operationalprocesses for pipe securing apparatus 200 and/or quality control module300. Programs may include various user programs so that a user caninteract with the pipe securing apparatus 200 and/or quality controlmodule 300 to perform various functions such as, but not limited to,inputting controls, viewing and manipulating data as well as sendingmessages as the case may be.

Memory unit 314 may also accept data from one of the input devices,communications module 308, and I/O hardware 306. Memory unit 314 usesthe received data to define and store, for example, at least a subset ofrecorded sensor data (e.g. temperature, pressure and/or location data)for one or more operations of pipe securing apparatus 200, as discussedabove.

An example embodiment for a method for applying a mechanical restraintmember 100 using a pipe securing apparatus 200 having a quality controlmodule 300 will now be described with reference to FIG. 61 and is showngenerally as 500.

The method starts at 502. At 504, after joining the two componentstogether, using, for example, an insertion fit, and positioning aflexible substrate 110 about the joint, a user positions a pipe securingapparatus 200 about the joint and the flexible substrate 110. If thepipe securing apparatus 200 is an annular cuff, it may be slid over oneend of one of the piping system components. If the pipe securingapparatus 200 is a linear cuff, it may be wrapped around the joint andone end of the pipe cuff may be connected to the other end of the pipecuff.

At 506, a user activates the controls for pipe securing apparatus 200and/or quality control module 300, for example by interacting with touchscreen display 350. During start-up, optionally at 508 the controllermay confirm, for linear pipe cuffs, that the ends 216, 218 of the cuffare properly secured to each other by, for example, confirming that acircuit between them is complete, indicating that the pipe cuff has beenconnected to itself. If not, an error may be displayed at 510 a.Otherwise, the method proceeds to 512.

At 512, the control electronics may actuate the pipe securing apparatus200 to apply pressure. For example, a fluid inlet port coupled to asource or pressurized gas may be opened to inflate one or more pressurechambers 220.

At 514, the control electronics may verify, using e.g. one or morepressure sensors, that a correct bonding pressure has been reached(e.g., a desired pressure has been achieved in the pressure chamber). Inthe exemplified method, the control software may continuously monitor(e.g. using a timeout subroutine 516 a) the duration of time that thepressure has been applied without reaching the specified bondingpressure. If subroutine 516 a determines that pressure has been appliedfor a predetermined amount of time without reaching the specifiedbonding pressure, at 510 b an error may be displayed.

Once the correct bonding pressure is determined to have been reached at514, control electronics may direct the heating module 210 to apply heatto the flexible substrate 110, e.g. via one or more heating members 142adjacent inner surface 214 of pressure cuff 200.

At 520, control electronics may monitor one or more temperature sensorsto determine if a correct bonding temperature has been reached (e.g.,the heating element has reached a desired temperature). Again, a timeout subroutine 516 b may be used to monitor the duration of time overwhich heat has been applied without reaching the correct bondingtemperature. If a time out condition is reached, an error may bedisplayed at 510 c, and the heat may be turned off at 524.

Once the control electronics determines at 520 that the correct bondingtemperature has been reached, the method proceeds to 522, where one ormore force sensors may be used to determine whether or not a correctbonding force has been reached (e.g., by determining if the pressurecuff has applied a desired pressure to the conduits). If a correctbonding force is not reached, an error may be displayed at 510 d, andthe heat may be turned off at 524. Otherwise, upon determining thecorrect bonding force has been reached, the control electronics may turnoff the heat at 524 and begin a logging operation.

At 526, control electronics may optionally determine a geographicallocation of the pressure cuff 200 and/or quality control module 300,e.g. using a location sensor, and store this data to memory. At 528control electronics may optionally use an optical sensor to determine acolour of, or colour change, or other visual change, of all or a portionof an outer surface of flexible substrate 110, as discussed previously.This GPS and/or optical data, along with any pressure, temperature, andforce data collected earlier (e.g. during steps 512, 514, 518, 520, 522)may be transmitted to another computing device at 530, and/or internallystored to memory at 532. It will be appreciated that any of the data mayalso optionally be displayed at the device, e.g. via display 350.

At 534, after logging and storing the data, a label listing none, some,or all of the logged data may optionally be printed. The label may beaffixed on or adjacent the joint that was checked to indicate that theapplication of the mechanical restraint member has been checked. It willbe appreciated that the label may merely indicate that the applicationof the mechanical restraint member was checked and approved.

At 536, another temperature measurement may be taken. For example, oneor more temperature sensors may be used to measure the surfacetemperature of the outer surface 112 of flexible substrate 110. If thetemperature is determined to be too high for, e.g. safe removal of pipesecuring apparatus 200, an optional cooling module may be turned on at538 to cool the flexible substrate 110. If a cooling module is activatedat 538, a timing subroutine 516 c may be used to determine if thecooling has been on for a predetermined amount of time without reachinga predetermined temperature, and an error may optionally be displayed at510 e.

After optionally determining at 536 that the mechanical restraint memberhas sufficiently cooled, or after the errors at 510 b-e, at 540 controlelectronics may reduce the pressure being applied (e.g. by deflatingpressure chamber 220) in order to deflate the pressure cuff. At 542, thepressure may be monitored to confirm that the cuff has been sufficientlydeflated to allow a safe removal. Again, a time out subroutine 516 d maybe used.

At 544, after determining that the pressure cuff has been sufficientlydepressurized, a signal may be provided (e.g. either on display 350 orusing some other mechanism, such as an indicator light) to confirm theapplication of mechanical restraint member 100 is complete.

At 546, a user may remove pipe securing apparatus 200 from its positionabout the joint, leaving behind one or more mechanical restraint members100 secured in position.

As used herein, the wording “and/or” is intended to represent aninclusive—or. That is, “X and/or Y” is intended to mean X or Y or both,for example. As a further example, “X, Y, and/or Z” is intended to meanX or Y or Z or any combination thereof.

While the above description describes features of example embodiments,it will be appreciated that some features and/or functions of thedescribed embodiments are susceptible to modification without departingfrom the spirit and principles of operation of the describedembodiments. For example, the various characteristics which aredescribed by means of the represented embodiments or examples may beselectively combined with each other. Accordingly, what has beendescribed above is intended to be illustrative of the claimed conceptand non-limiting. It will be understood by persons skilled in the artthat other variants and modifications may be made without departing fromthe scope of the invention as defined in the claims appended hereto. Thescope of the claims should not be limited by the preferred embodimentsand examples, but should be given the broadest interpretation consistentwith the description as a whole.

1. A method for joining a first conduit section having an open first endand an inner surface with a second conduit section having an outersurface, the method comprising: a) inserting a first end of the secondconduit section in the open first end of the first conduit section witha gasket extending between the inner surface of the first conduitsection and the outer surface of the second conduit section; b)positioning a flexible substrate having an activatable bonding agentprovided on at least a portion of an inner side of the flexiblesubstrate to extend from an outer surface of the first conduit to anouter surface of the second conduit; c) applying pressure to theflexible substrate whereby the bonding agent is pressed against an outersurface of the first and second conduit sections; and, d) activating thebonding agent whereby the bonding agent is secured to the outer surfaceof the first and second conduit sections.
 2. A method for joining afirst conduit section having an open first end and an inner surface witha second conduit section having an outer surface, the method comprising:a) inserting a first end of the second conduit section in the open firstend of the first conduit section with a gasket extending between theinner surface of the first conduit section and the outer surface of thesecond conduit section; b) positioning a flexible substrate on each ofthe first and second conduits with an activatable bonding agentpositioned between an inner side of the flexible substrate and an outersurface of each of the first conduit and the second conduit; c) applyingpressure to the flexible substrate whereby the bonding agent is pressedagainst an outer surface of the first and second conduit sections whilethe bonding agent bonds to the outer surface of the first and secondconduit sections.
 3. The method of claim 2 wherein at least some of theactivatable bonding agent is positioned between an inner side of theflexible substrate and an outer surface of each of the first conduit andthe second conduit prior to the pressure being applied.
 4. The method ofclaim 2 wherein at least some of the activatable bonding agent ispositioned between an inner side of the flexible substrate and an outersurface of each of the first conduit and the second conduit after thepressure is applied.
 5. The method of claim 2 wherein the step ofpositioning the flexible substrate comprises wrapping the flexiblesubstrate around the exterior surface of the first and second conduits.6. The method of claim 5 wherein the flexible substrate is secured inposition by an adhesive after the flexible substrate has been wrappedaround the exterior surface of the first and second conduits.
 7. Themethod of claim 6 wherein the adhesive is a releasable adhesive wherebythe flexible adhesive is repositionable.
 8. The method of claim 2wherein the step of applying pressure comprises positioning aninflatable member around an exterior surface of the flexible substrateand inflating the inflatable member.
 9. The method of claim 8 whereinthe inflatable member comprises an inflatable annular member and themethod further comprises sliding the inflatable member along one of theconduit sections and positioning the inflatable member to overlie atleast a portion of the flexible substrate.
 10. The method of claim 8wherein the inflatable member comprises a longitudinally extendingmember having a first portion that is securable to a second portion andthe method further comprises wrapping the longitudinally extendingmember around at least one of the conduit sections and securing thefirst portion to the second portion such that the inflatable memberoverlies at least a portion of the flexible substrate.
 11. The method ofclaim 2 wherein the flexible substrate includes an inflatable member andthe step of applying pressure comprises inflating the inflatable member.12. The method of claim 2 wherein the flexible substrate comprises aplurality of discrete members and step (b) comprises positioning each ofthe discrete members on an outer portion of each of the first and secondconduits.
 13. The method of claim 1 wherein the activatable bondingagent is a thermally activatable bonding agent and the step ofactivating the bonding agent comprises applying heat to the bondingagent.
 14. The method of claim 13 wherein the step of applying heat tothe bonding agent comprises applying heat to the bonding agent from anexternal source.
 15. The method of claim 14 wherein the external sourcecomprises one or more of a resistive heating element, an exothermicreactive composition, an infrared source or a microwave source.
 16. Themethod of claim 14 wherein the step of applying pressure comprisespositioning an apparatus comprising an inflatable member around anexterior surface of the flexible substrate and inflating the inflatablemember and the apparatus includes the external heat source.
 17. Themethod of claim 13 wherein the flexible substrate incorporates at leastone of a resistive heating element and an exothermic reactivecomposition and the step of heating the bonding agent comprisesactivating the at least one of the resistive heating element and theexothermic reactive composition.
 18. The method of claim 13 wherein thefirst and second conduit sections comprise a thermoplastic material thathas a melting temperature and the heating step comprises heating thebonding agent to a temperature above a melting point of the bondingagent.
 19. The method of claim 18 wherein the melting temperature of thebonding agent is less than the melting temperature of the first conduitsection and the second conduit section and the method further comprisesheating the bonding agent to a temperature less that the meltingtemperature of the first conduit section and the second conduit section.20. The method of claim 1 wherein the activatable bonding agent issettable at room temperature and the step of activating the bondingagent comprises exposing the bonding agent to the ambient.
 21. Themethod of claim 2 wherein the activatable bonding agent is a thermallyactivatable bonding agent and the method further comprises applying heatto the bonding agent.
 22. The method of claim 21 wherein the step ofapplying heat to the bonding agent comprises applying heat to thebonding agent from an external source.
 23. The method of claim 22wherein the external source comprises one or more of a resistive heatingelement, an exothermic reactive composition, an infrared source or amicrowave source.
 24. The method of claim 22 wherein the step ofapplying pressure comprises positioning an apparatus comprising aninflatable member around an exterior surface of the flexible substrateand inflating the inflatable member and the apparatus includes theexternal heat source.
 25. The method of claim 21 wherein the flexiblesubstrate incorporates at least one of a resistive heating element andan exothermic reactive composition and the step of heating the bondingagent comprises activating the at least one of the resistive heatingelement and the exothermic reactive composition.
 26. The method of claim21 wherein the first and second conduit sections comprise athermoplastic material that has a melting temperature and the heatingstep comprises heating the bonding agent to a temperature above amelting point of the bonding agent.
 27. The method of claim 26 whereinthe melting temperature of the bonding agent is less than the meltingtemperature of the first conduit section and the second conduit sectionand the method further comprises heating the bonding agent to atemperature less that the melting temperature of the first conduitsection and the second conduit section.
 28. The method of claim 2wherein the activatable bonding agent is settable at room temperatureand the method further comprises exposing the bonding agent to theambient.